DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 141
DF3052BX25V
Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3052BX25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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6.1.3
Table 6.1 summarizes the bus controller’s input/output pins.
Table 6.1
Name
Chip select 0 to 7
Address strobe
Read
High write
Low write
Wait
Bus request
Bus acknowledge
Pin Configuration
Bus Controller Pins
Abbreviation
CS
AS
RD
HWR
LWR
WAIT
BREQ
BACK
0
to CS
7
I/O
Output
Output
Output
Output
Output
Input
Input
Output
Function
Strobe signals selecting areas 0 to 7
Strobe signal indicating valid address output
on the address bus
Strobe signal indicating reading from the
external address space
Strobe signal indicating writing to the
external address space, with valid data on
the upper data bus (D
Strobe signal indicating writing to the
external address space, with valid data on
the lower data bus (D
Wait request signal for access to external
three-state-access areas
Request signal for releasing the bus to an
external device
Acknowledge signal indicating the bus is
released to an external device
Rev. 3.00 Mar 21, 2006 page 111 of 814
Section 6 Bus Controller
7
15
to D
to D
REJ09B0302-0300
0
)
8
)
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