SAK-XC2365B-40F80L Infineon Technologies, SAK-XC2365B-40F80L Datasheet - Page 123
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SAK-XC2365B-40F80L
Manufacturer Part Number
SAK-XC2365B-40F80L
Description
IC MCU 16BIT FLASH 100-LQFP
Manufacturer
Infineon Technologies
Series
XC23xxBr
Specifications of SAK-XC2365B-40F80L
Core Processor
C166SV2
Core Size
16/32-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
320KB (320K x 8)
Program Memory Type
FLASH
Ram Size
34K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-LSQFP
Processor Series
XC23xx
Core
C166S V2
Data Bus Width
32 bit
3rd Party Development Tools
PK166, CA166, AR166, ULINK2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
SP000486208
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SAK-XC2365B-40F80L
Manufacturer:
Infineon Technologies
Quantity:
10 000
Company:
Part Number:
SAK-XC2365B-40F80L AA
Manufacturer:
Infineon Technologies
Quantity:
10 000
Table 41
Parameter
TDI/TMS hold after TCK
rising edge
TDO valid from TCK falling
edge (propagation delay)
TDO high impedance to
valid output from TCK
falling edge
TDO valid output to high
impedance from TCK
falling edge
TDO hold after TCK falling
edge
1) The falling edge on TCK is used to generate the TDO timing.
2) The setup time for TDO is given implicitly by the TCK cycle time.
Figure 30
Data Sheet
0.5
1)
V
D D P
2)1)
1)
JTAG Interface Timing for Lower Voltage Range (cont’d)
Test Clock Timing (TCK)
t
2
1)
Symbol
t
t
t
t
t
t
7
8
9
10
18
1
SR
CC
CC
CC
CC
t
3
Min.
6
−
−
−
5
XC2361B, XC2363B, XC2364B, XC2365B
123
Values
Typ.
−
32
32
32
−
t
5
XC2000 Family / Value Line
Max.
−
36
36
36
−
Unit Note /
ns
ns
ns
ns
ns
Electrical Parameters
t
4
Test Condition
MC_ JTAG_ TCK
V1.2, 2010-04
0.9
0.1
V
V
D D P
D D P