UPD70F3744GJ-GAE-AX Renesas Electronics America, UPD70F3744GJ-GAE-AX Datasheet - Page 184

• Manufacturer Part Number: UPD70F3744GJ-GAE-AX
• Description: MCU 32BIT V850ES/JX3 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3r

Specifications of UPD70F3744GJ-GAE-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 128
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 2.85 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

V850ES/JJ3
5.3
programmable wait function and bus cycle operation mode for each of these blocks can be independently controlled in
one-block units.
R01UH0016EJ0400 Rev.4.00
Sep 30, 2010
The 16 MB external memory space is divided into memory blocks of (lower) 2 MB, 2 MB, 4 MB, and 8 MB. The
Note This area is an external memory area in the case of a data write access.
Memory Block Function
0 3 F F F F F F H
0 3 F F 0 0 0 0 H
0 3 F E F F F F H
0 1 0 0 0 0 0 0 H
0 0 F F F F F F H
0 0 8 0 0 0 0 0 H
0 0 7 F F F F F H
0 0 4 0 0 0 0 0 H
0 0 3 F F F F F H
0 0 2 0 0 0 0 0 H
0 0 1 F F F F F H
0 0 0 0 0 0 0 0 H
External memory area
External memory area
External memory area
Use prohibited
(64 KB)
(8 MB)
(4 MB)
(2 MB)
(2 MB)
Figure 5-1. Data Memory Map: Physical Address
CS3
CS2
CS1
CS0
CHAPTER 5 BUS CONTROL FUNCTION
External memory area
Internal ROM area
On-chip peripheral
Internal RAM area
I/O area (4 KB)
(60 KB)
(1 MB)
(1 MB)
Note
0 3 F F 0 0 0 0 H
0 3 F F F F F F H
0 3 F F F 0 0 0 H
0 3 F F E F F F H
0 0 1 F F F F F H
0 0 1 0 0 0 0 0 H
0 0 0 F F F F F H
0 0 0 0 0 0 0 0 H
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