PIC16LF819T-E/SO Microchip Technology, PIC16LF819T-E/SO Datasheet - Page 7

• Manufacturer Part Number: PIC16LF819T-E/SO
• Description: IC PIC MCU FLASH 2KX14 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16LF819T-E/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 18-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Request inventory verification / Request inventory verification

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Timer0 Module ......................................................................................................................................................................... 111
11.0 Timer1 Module ......................................................................................................................................................................... 115
12.0 Timer2 Module ......................................................................................................................................................................... 121
13.0 Capture/Compare/PWM (CCP) Module ................................................................................................................................... 123
14.0 Universal Serial Bus (USB) ...................................................................................................................................................... 129
15.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)....................................................................................... 153
16.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 175
17.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 185
18.0 Special Features of the CPU.................................................................................................................................................... 191
19.0 Instruction Set Summary .......................................................................................................................................................... 213
20.0 Development Support............................................................................................................................................................... 263
21.0 Electrical Characteristics .......................................................................................................................................................... 267
22.0 Packaging Information.............................................................................................................................................................. 295
Appendix A: Revision History............................................................................................................................................................. 307
Appendix B: Device Differences ........................................................................................................................................................ 308
Appendix C: Conversion Considerations ........................................................................................................................................... 309
Appendix D: Migration From Baseline to Enhanced Devices ............................................................................................................ 309
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 310
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 310
Index ................................................................................................................................................................................................. 311
The Microchip Web Site ..................................................................................................................................................................... 319
Customer Change Notification Service .............................................................................................................................................. 319
Customer Support .............................................................................................................................................................................. 319
Reader Response .............................................................................................................................................................................. 320
Product Identification System ............................................................................................................................................................ 321
© 2008 Microchip Technology Inc.
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 23
Power-Managed Modes ............................................................................................................................................................. 33
Reset .......................................................................................................................................................................................... 41
Memory Organization ................................................................................................................................................................. 53
Flash Program Memory.............................................................................................................................................................. 73
8 x 8 Hardware Multiplier............................................................................................................................................................ 83
Interrupts .................................................................................................................................................................................... 85
I/O Ports ..................................................................................................................................................................................... 99
PIC18F2450/4450
DS39760D-page 5