MC68HC908SR12CFA Freescale Semiconductor, MC68HC908SR12CFA Datasheet - Page 389

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MC68HC908SR12CFA

Manufacturer Part Number
MC68HC908SR12CFA
Description
MICROCONTROLLER 48 PIN
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet

Specifications of MC68HC908SR12CFA

Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, SCI
Peripherals
LVD, POR, PWM, Temp Sensor
Number Of I /o
31
Program Memory Size
12KB (12K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
Q1145673

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC908SR12CFA
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
25.4 42-Pin Shrink Dual In-Line Package (SDIP)
MC68HC908SR12•MC68HC08SR12 — Rev. 5.0
Freescale Semiconductor
SEATING
PLANE
–T–
42
1
D
F
0.25 (0.010)
42 PL
–A–
M
T
Figure 25-2. 42-Pin SDIP (Case #858-01)
G
A
S
22
21
N
Mechanical Specifications
C
K
–B–
J
42 PL
0.25 (0.010)
M
H
T
L
B
M
42-Pin Shrink Dual In-Line Package (SDIP)
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
Y14.5M, 1982.
FORMED PARALLEL.
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
DIM
G
M
A
B
C
D
F
H
J
K
L
N
Mechanical Specifications
1.435
0.540
0.155
0.014
0.032
0.008
0.115
0.020
MIN
0.070 BSC
0.300 BSC
0.600 BSC
INCHES
MAX
1.465
0.560
0.200
0.022
0.046
0.015
0.135
0.040
15°
36.45
13.72
MILLIMETERS
MIN
3.94
0.36
0.81
0.20
2.92
0.51
1.778 BSC
15.24 BSC
7.62 BSC
Data Sheet
37.21
14.22
MAX
5.08
0.56
1.17
0.38
3.43
1.02
15°
389

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