AT86RF401U-XI Atmel, AT86RF401U-XI Datasheet - Page 50

IC MICRO TX RF W/AVR 20-TSSOP

AT86RF401U-XI

Manufacturer Part Number
AT86RF401U-XI
Description
IC MICRO TX RF W/AVR 20-TSSOP
Manufacturer
Atmel
Datasheet

Specifications of AT86RF401U-XI

Frequency
264MHz ~ 456MHz
Applications
Garage Opener, RKE, Telemetry
Modulation Or Protocol
ASK, OOK
Data Rate - Maximum
10 kbps
Power - Output
6dBm
Current - Transmitting
23.2mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Memory Size
2KB Flash, 128 Byte EEPROM, 128Byte SRAM
Voltage - Supply
2 V ~ 5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
20-TSSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Other names
AT86RF401U
Package Drawing
20A2 – TSSO
50
Notes:
A
AT86RF401
R
1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation AC, for additional
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess
5. Dimension D and E1 to be determined at Datum Plane H.
E
2325 Orchard Parkway
San Jose, CA 95131
information.
not exceed 0.15 mm (0.006 in) per side.
0.25 mm (0.010 in) per side.
of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.
Minimum space between protrusion and adjacent lead is 0.07 mm.
E1
Side View
Top View
b
e
All devices are packaged on tape in reel; standard reel quantity is 2,500 pieces.
D
TITLE
20A2, 20-lead (4.4 x 6.5 mm Body), 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
A2
SYMBOL
D
E
E1
A
A2
b
e
L
L1
End View
6.40
4.30
0.80
0.19
0.45
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
6.40 BSC
0.65 BSC
L1
1.00 REF
NOM
6.50
4.40
1.00
0.60
L
DRAWING NO.
20A2
6.60
4.50
1.20
1.05
0.30
0.75
MAX
1424F–RKE–12/03
NOTE
2, 5
3, 5
6/3/02
4
REV.
C

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