VNC2-48Q1B-REEL FTDI, VNC2-48Q1B-REEL Datasheet - Page 85

• Manufacturer Part Number: VNC2-48Q1B-REEL
• Description: USB Interface IC Vinculum-II Dual USB Host/Dev IC QFN-48
• Manufacturer: FTDI
• Type: USB Host/Device Controllerr

Specifications of VNC2-48Q1B-REEL

• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 85 C
• Supply Current: 25 mA
• Operating Supply Voltage: 1.8 V, 3.3V
• Package / Case: QFN-48
• Description/function: USB Vinculum-II Dual Host/Dev IC QFN-48
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: VINCULUM2

Table 38 Reflow Profile Parameter Values
Table 39 Package Reflow Peak Temperature
SnPb Eutectic and Pb free (non green material)
Pb Free (green material) = 260 +5/-0 deg C
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
Time for T= 25°C to Peak Temperature, T
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Package Thickness
Profile Feature
Ramp Down Rate
- Time (t
≥
< 2.5 mm
Preheat
s
Copyright © 2010 Future Technology Devices International Limited
2.5 mm
Min to t
(t
T
L
p
:
)
L
)
s
VINCULUM-II EMBEDDED DUAL USB HOST CONTROLLER IC Datasheet
Max)
s
s
L
)
Min.)
Max.)
s
p
)
to T
p
)
p
Pb Free Solder Process
Volume mm3 < 350
(green material)
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
235 +5/-0 deg C
220 +5/-0 deg C
30 to 40 seconds
8 minutes Max.
150°C
200°C
217°C
260°C
SnPb Eutectic and Pb free (non
green material) Solder Process
Document No.: FT_000138
Clearance No.: FTDI#
Volume mm3 >=350
3°C / Second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
220 +5/-0 deg C
220 +5/-0 deg C
20 to 40 seconds
6 minutes Max.
see Table 39
100°C
150°C
183°C
Version -
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1.2
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