MPC8536BVTAVL Freescale Semiconductor, MPC8536BVTAVL Datasheet - Page 35

Microprocessors (MPU) 8536 INDUSTRIAL 1500

MPC8536BVTAVL

Manufacturer Part Number
MPC8536BVTAVL
Description
Microprocessors (MPU) 8536 INDUSTRIAL 1500
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8536BVTAVL

Processor Series
MPC85xx
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
1500 MHz
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
0 C
Package / Case
FCPBGA-783
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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At recommended operating conditions with GV
MDQS epilogue end
Note:
1. The symbols used for timing specifications follow the pattern of t
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS.
4. Note that t
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC
6. All outputs are referenced to the rising edge of MCK[n] at the pins of the microprocessor. Note that t
7. Maximum DDR2 and DDR3 frequency is 667 MHz
Freescale Semiconductor
inputs and t
(DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example,
t
(A) are setup (S) or output valid time. Also, t
(K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
from the rising edge of the MCK[n] clock (KH) until the MDQS signal is valid (MH). t
of the DQSS override bits in the TIMING_CFG_2 register. This will typically be set to the same delay as the clock adjust in the
CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set to the same
adjustment value. See the MPC8536E PowerQUICC III Integrated Processor Reference Manual for a description and
understanding of the timing modifications enabled by use of these bits.
(MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor.
symbol conventions described in note 1.
DDKHAS
symbolizes DDR timing (DD) for the time t
DDKHMH
(first two letters of functional block)(reference)(state)(signal)(state)
Parameter
For the ADDR/CMD setup and hold specifications in
Control register is set to adjust the memory clocks by 1/2 applied cycle.
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3
follows the symbol conventions described in note 1. For example, t
Table 19. DDR SDRAM Output AC Timing Specifications (continued)
<= 667 MHz
<= 667 MHz
DD
of 1.8 V ± 5% for DDR2 or 1.5 V ± 5% for DDR3.
DDKLDX
Symbol
t
DDKHME
MCK
symbolizes DDR timing (DD) for the time t
1
memory clock reference (K) goes from the high (H) state until outputs
NOTE
0.9 × t
0.4 × t
(first two letters of functional block)(signal)(state) (reference)(state)
Min
for outputs. Output hold time can be read as DDR timing
MCK
MCK
Table
19, it is assumed that the Clock
0.6 × t
DDKHMH
Max
DDKHMH
MCK
can be modified through control
describes the DDR timing (DD)
MCK
DDR2 and DDR3 SDRAM
memory clock reference
DDKHMP
Unit
ns
follows the
Notes
7
6
7
for
35

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