A54SX08A-TQG100 Actel, A54SX08A-TQG100 Datasheet - Page 2
![FPGA - Field Programmable Gate Array 12K System Gates](/photos/16/14/161495/tqfp-100_sml.jpg)
A54SX08A-TQG100
Manufacturer Part Number
A54SX08A-TQG100
Description
FPGA - Field Programmable Gate Array 12K System Gates
Manufacturer
Actel
Datasheet
1.A54SX08A-TQG100.pdf
(108 pages)
Specifications of A54SX08A-TQG100
Processor Series
A54SX08
Core
IP Core
Number Of Macrocells
512
Maximum Operating Frequency
350 MHz
Number Of Programmable I/os
130
Delay Time
4 ns to 8.4 ns
Supply Voltage (max)
5.25 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Development Tools By Supplier
Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
2.25 V
Number Of Gates
8000
Package / Case
TQFP-100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
A54SX08A-TQG100
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
A54SX08A-TQG100
Manufacturer:
MICROSEMI/美高森美
Quantity:
20 000
Company:
Part Number:
A54SX08A-TQG100A
Manufacturer:
Microsemi SoC
Quantity:
10 000
Company:
Part Number:
A54SX08A-TQG100I
Manufacturer:
Microsemi SoC
Quantity:
10 000
Ordering Information
Notes:
1. For more information about the CQFP package options, refer to the
2. All –3 speed grades have been discontinued.
Device Resources
ii
Device
A54SX08A
A54SX16A
A54SX32A
A54SX72A
Notes: Package Definitions: PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, PBGA = Plastic Ball Grid Array,
SX-A Family FPGAs
FBGA = Fine Pitch Ball Grid Array
A54SX16A
208-Pin
PQFP
130
175
174
171
Part Number
A54SX08A = 12,000 System Gates
A54SX16A = 24,000 System Gates
A54SX32A = 48,000 System Gates
A54SX72A = 108,000 System Gates
2
100-Pin
TQFP
81
81
81
–
PQ
Speed Grade
Blank = Standard Speed
–1 = Approximately 15% Faster than Standard
–2 = Approximately 25% Faster than Standard
–3 = Approximately 35% Faster than Standard
–F = Approximately 40% Slower than Standard
144-Pin
Package Type
TQFP
113
113
113
G
–
User I/Os (Including Clock Buffers)
BG = 1.27 mm Plastic Ball Grid Array
FG = 1.0 mm Fine Pitch Ball Grid Array
PQ = Plastic Quad Flat Pack
TQ = Thin (1.4 mm) Quad Flat Pack
CQ = Ceramic Quad Flat Pack
Lead-Free Packaging
208
Blank = Standard Packaging
G = RoHS Compliant Packaging
v5.3
176-Pin
TQFP
147
–
–
–
HiRel SX-A
Package Lead Count
329-Pin
PBGA
Application (Temperature Range)
249
datasheet.
Blank = Commercial (0 to +70°)
–
–
–
A
M = Military (-55 to +125°C)
B
I
1
= MIL-STD-883 Class B
= Automotive (-40 to +125°C)
= Industrial (-40 to +85°C)
144-Pin
FBGA
111
111
111
2
–
256-Pin
FBGA
180
203
203
–
484-Pin
FBGA
249
360
–
–