PSMN023-80LS,115 NXP Semiconductors, PSMN023-80LS,115 Datasheet - Page 3

no-image

PSMN023-80LS,115

Manufacturer Part Number
PSMN023-80LS,115
Description
MOSFET N-CH QFN3333
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PSMN023-80LS,115

Input Capacitance (ciss) @ Vds
1295pF @ 40V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
23 mOhm @ 10A, 10V
Drain To Source Voltage (vdss)
80V
Current - Continuous Drain (id) @ 25° C
34A
Vgs(th) (max) @ Id
4V @ 1mA
Gate Charge (qg) @ Vgs
21nC @ 10V
Power - Max
65W
Mounting Type
Surface Mount
Package / Case
8-VDFN Exposed Pad
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
23 mOhms
Drain-source Breakdown Voltage
80 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
34 A
Power Dissipation
65 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-5583-2
NXP Semiconductors
4. Limiting values
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
PSMN023-80LS
Product data sheet
Symbol
V
V
V
I
I
P
T
T
T
Source-drain diode
I
I
Avalanche ruggedness
E
D
DM
S
SM
Fig 1.
stg
j
sld(M)
DS
DGR
GS
tot
DS(AL)S
(A)
I
D
40
30
20
10
0
mounting base temperature
V
Continuous drain current as a function of
0
GS
Limiting values
≥ 10 V
Parameter
drain-source voltage
drain-gate voltage
gate-source voltage
drain current
peak drain current
total power dissipation
storage temperature
junction temperature
peak soldering temperature
source current
peak source current
non-repetitive drain-source
avalanche energy
50
100
150
T
All information provided in this document is subject to legal disclaimers.
003aae497
mb
(°C)
200
Conditions
T
T
V
V
pulsed; t
see
T
T
pulsed; t
V
V
Rev. 2 — 18 August 2010
j
j
mb
mb
GS
GS
GS
sup
≥ 25 °C; T
≥ 25 °C; T
Figure 3
= 25 °C; see
= 25 °C
= 10 V; T
= 10 V; T
= 10 V; T
≤ 80 V; R
N-channel QFN3333 80 V 23 mΩ standard level MOSFET
p
p
≤ 10 µs; T
≤ 10 µs; T
j
j
Fig 2.
≤ 175 °C
≤ 175 °C; R
mb
mb
j(init)
GS
= 100 °C; see
= 25 °C; see
= 50 Ω; unclamped
P
Figure 2
(%)
= 25 °C; I
der
120
80
40
mb
mb
0
function of solder point temperature
Normalized total power dissipation as a
0
= 25 °C;
= 25 °C
GS
D
= 20 kΩ
= 34 A;
Figure 1
Figure 1
50
PSMN023-80LS
100
Min
-
-
-20
-
-
-
-
-55
-55
-
-
-
-
150
© NXP B.V. 2010. All rights reserved.
T
003aab937
mb
150
150
260
Max
80
80
20
22
34
137
65
34
137
37
(°C)
200
Unit
V
V
V
A
A
A
W
°C
°C
°C
A
A
mJ
3 of 14

Related parts for PSMN023-80LS,115