LPC11C22FBD48/301, NXP Semiconductors, LPC11C22FBD48/301, Datasheet - Page 28
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LPC11C22FBD48/301,
Manufacturer Part Number
LPC11C22FBD48/301,
Description
TXRX CORTEX CAN 16K FLASH
Manufacturer
NXP Semiconductors
Series
LPC11Cxxr
Datasheet
1.LPC11C14FBD48301.pdf
(61 pages)
Specifications of LPC11C22FBD48/301,
Core Processor
ARM Cortex-M0
Core Size
32-Bit
Speed
50MHz
Connectivity
CAN, CAN Transceiver, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
36
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Other names
568-6643
LPC11C22FBD48/301
LPC11C22FBD48/301
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC11C22FBD48/301,
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
8. Limiting values
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
LPC11CX2_CX4
Product data sheet
Symbol
V
V
I
I
I
T
T
P
V
DD
SS
latch
stg
j(max)
DD
I
tot(pack)
ESD
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
Including voltage on outputs in 3-state mode.
The peak current is limited to 25 times the corresponding maximum current.
Dependent on package type.
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
otherwise noted.
Limiting values
Parameter
supply voltage (core
and external rail)
input voltage
supply current
ground current
I/O latch-up current
storage temperature
maximum junction
temperature
total power dissipation
(per package)
electrostatic discharge
voltage
Conditions
on pins V
5 V tolerant I/O pins; only valid when the V
voltage is present
per supply pin
per ground pin
(0.5V
T
based on package heat transfer, not device power
consumption
human body model;
j
all pins except CAN on-chip transceiver pins CANL,
CANH, STB, VDD_CAN, V
LPC11C22/C24
pins CANH and CANL on LPC11C22/C24
pins STB, VDD_CAN, V
LPC11C22/C24
< 125 C
All information provided in this document is subject to legal disclaimers.
DD
) < V
DD
Rev. 2 — 3 December 2010
I
< (1.5V
DD
);
CC
, GND on
CC
, GND on
[1]
DD
32-bit ARM Cortex-M0 microcontroller
supply
LPC11Cx2/Cx4
[2]
[3]
[3]
[4]
[5]
[5]
[5]
Min
1.8
0.5
-
-
-
65
-
-
6500
8000
4000
© NXP B.V. 2010. All rights reserved.
Max
3.6
+5.5
100
100
100
+150
150
1.5
+6500
+8000
+4000
SS
unless
28 of 61
Unit
V
V
mA
mA
mA
C
C
W
V
V
V