F276-CEG-T-TR STMicroelectronics, F276-CEG-T-TR Datasheet - Page 129

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F276-CEG-T-TR

Manufacturer Part Number
F276-CEG-T-TR
Description
IC MCU 16BIT 832KB FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheet

Specifications of F276-CEG-T-TR

Core Processor
ST10
Core Size
16-Bit
Speed
48MHz
Connectivity
ASC, CAN, EBI/EMI, I²C, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Size
832KB (832K x 8)
Program Memory Type
FLASH
Ram Size
68K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LFQFP
Processor Series
ST10F27x
Core
ST10
Data Bus Width
16 bit
Data Ram Size
68 KB
Interface Type
CAN, I2C
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
111
Number Of Timers
2
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 24 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
F276-CEG-T-TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
ST10F276E
20
Note:
20.1
20.2
Power reduction modes
Three different power reduction modes with different levels of power reduction have been
implemented in the ST10F276E. In Idle mode only CPU is stopped, while peripheral still
operate. In Power Down mode both CPU and peripherals are stopped. In Stand-by mode
the main power supply (V
powered via V
Idle and Power Down modes are software activated by a protected instruction and are
terminated in different ways as described in the following sections.
Stand-by mode is entered simply removing V
All external bus actions are completed before Idle or Power Down mode is entered.
However, Idle or Power Down mode is not entered if READY is enabled, but has not been
activated (driven low for negative polarity, or driven high for positive polarity) during the last
bus access.
Idle mode
Idle mode is entered by running IDLE protected instruction. The CPU operation is stopped
and the peripherals still run.
Idle mode is terminate by any interrupt request. Whatever the interrupt is serviced or not,
the instruction following the IDLE instruction will be executed after return from interrupt
(RETI) instruction, then the CPU resumes the normal program.
Power down mode
Power Down mode starts by running PWRDN protected instruction. Internal clock is
stopped, all MCU parts are on hold including the watchdog timer. The only exception could
be the Real-Time Clock if opportunely programmed and one of the two oscillator circuits as
a consequence (either the main or the 32 kHz on-chip oscillator).
When Real-Time Clock module is used, when the device is in Power Down mode a
reference clock is needed. In this case, two possible configurations may be selected by the
user application according to the desired level of power reduction:
There are two different operating Power Down modes: protected mode and interruptible
mode.
A 32 kHz crystal is connected to the on-chip low-power oscillator (pins XTAL3 / XTAL4)
and running. In this case the main oscillator is stopped when Power Down mode is
entered, while the Real-Time Clock continue counting using 32 kHz clock signal as
reference. The presence of a running low-power oscillator is detected after the Power-
on: this clock is immediately assumed (if present, or as soon as it is detected) as
reference for the Real-Time Clock counter and it will be maintained forever (unless
specifically disabled via software).
Only the main oscillator is running (XTAL1 / XTAL2 pins). In this case the main
oscillator is not stopped when Power Down is entered, and the Real-Time Clock
continue counting using the main oscillator clock signal as reference.
STBY
dedicated power pin.
DD
) can be turned off while a portion of the internal RAM remains
DD
, holding the MCU under reset state.
Power reduction modes
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