F276-CEG-T-TR STMicroelectronics, F276-CEG-T-TR Datasheet - Page 166

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F276-CEG-T-TR

Manufacturer Part Number
F276-CEG-T-TR
Description
IC MCU 16BIT 832KB FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheet

Specifications of F276-CEG-T-TR

Core Processor
ST10
Core Size
16-Bit
Speed
48MHz
Connectivity
ASC, CAN, EBI/EMI, I²C, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Size
832KB (832K x 8)
Program Memory Type
FLASH
Ram Size
68K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LFQFP
Processor Series
ST10F27x
Core
ST10
Data Bus Width
16 bit
Data Ram Size
68 KB
Interface Type
CAN, I2C
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
111
Number Of Timers
2
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 24 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
F276-CEG-T-TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Register set
22.11
Note:
166/231
System configuration registers
The ST10F276E has registers used for a different configuration of the overall system. These
registers are described below.
SYSCON (FF12h / 89h)
SYSCON Reset Value is: 0000 0xx0 0x00 0000b
Table 77.
15
XPER-SHARE
BDRSTEN
PWDCFG
OWDDIS
VISIBLE
STKSZ
CSCFG
RW
XPEN
14
Bit
13
SYSCON description
ROM
RW
12
S1
XBUS peripheral share mode control
0: External accesses to XBUS peripherals are disabled.
1: XRAM1 and XRAM2 are accessible via the external bus during hold mode.
External accesses to the other XBUS peripherals are not guaranteed in terms of
AC timings.
Visible mode control
0: Accesses to XBUS peripherals are done internally.
1: XBUS peripheral accesses are made visible on the external pins.
XBUS peripheral enable bit
0: Accesses to the on-chip X-peripherals and XRAM are disabled.
1: The on-chip X-peripherals are enabled.
Bidirectional reset enable
0: RSTIN pin is an input pin only. SW Reset or WDT Reset have no effect on this
pin.
1: RSTIN pin is a bidirectional pin. This pin is pulled low during internal reset
sequence.
Oscillator watchdog disable control
0: Oscillator Watchdog (OWD) is enabled. If PLL is bypassed, the OWD monitors
XTAL1 activity. If there is no activity on XTAL1 for at least 1 µs, the CPU clock is
switched automatically to PLL’s base frequency (from 750 kHz to 3 MHz).
1: OWD is disabled. If the PLL is bypassed, the CPU clock is always driven by
XTAL1 signal. The PLL is turned off to reduce power supply current.
Power down mode configuration control
0: Power Down Mode can only be entered during PWRDN instruction execution if
NMI pin is low, otherwise the instruction has no effect. To exit Power Down Mode,
an external reset must occur by asserting the RSTIN pin.
1: Power Down Mode can only be entered during PWRDN instruction execution if
all enabled fast external interrupt EXxIN pins are in their inactive level. Exiting this
mode can be done by asserting one enabled EXxIN pin or with external reset.
Chip select configuration control
0: Latched Chip Select lines, CSx changes 1 TCL after rising edge of ALE.
1: Unlatched Chip Select lines, CSx changes with rising edge of ALE.
SGT
RW
DIS
11
ROM
RW
10
EN
RW
BYT
DIS
9
SFR
RW
CLK
EN
8
CFG
RW
WR
7
Function
CFG
RW
CS
6
PWD
CFG
RW
5
OWD
RW
DIS
4
STEN
BDR
RW
3
Reset value: 0xx0h
XPEN
RW
2
ST10F276E
RW
VISI
BLE
1
SHARE
XPER-
RW
0

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