MCIMX535DVV1C Freescale Semiconductor, MCIMX535DVV1C Datasheet - Page 150
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MCIMX535DVV1C
Manufacturer Part Number
MCIMX535DVV1C
Description
IMX53 REV 2.1 COMM
Manufacturer
Freescale Semiconductor
Specifications of MCIMX535DVV1C
Rohs Compliant
YES
Core Size
32bit
Program Memory Size
288KB
Cpu Speed
1GHz
Digital Ic Case Style
BGA
No. Of Pins
529
Supply Voltage Range
1.25V To 1.35V
Operating Temperature Range
-20°C To +85°C
Msl
MSL 3 - 168 Hours
Embedded Interface Type
I2C, SPI, UART
Lead Free Status / Rohs Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCIMX535DVV1C
Manufacturer:
LRC
Quantity:
21 000
Company:
Part Number:
MCIMX535DVV1C
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCIMX535DVV1C
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MCIMX535DVV1CR2
Manufacturer:
FREESCALE
Quantity:
556
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Package Information and Contact Assignments
6
Package Information and Contact Assignments
This section includes the contact assignment information and mechanical package drawing.
6.1
19x19 mm Package Information
This section contains the outline drawing, signal assignment map, ground/power reference ID (by ball grid
location) for the 19 × 19 mm, 0.8 mm pitch package.
6.1.1
Case TEPBGA-2, 19 x 19 mm, 0.8 mm Pitch, 23 x 23 Ball Matrix
Figure 98
shows the top view of the 19×19 mm package,
Figure 99
shows the bottom view and the ball
location (529 solder balls) of the 19×19 mm package, and
Figure 100
shows the side view of the 19×19
mm package.
Figure 98. 19 x 19 mm Package Top View
i.MX53xD Applications Processors for Consumer Products, Rev. 3
150
Freescale Semiconductor
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