MCIMX535DVV1C Freescale Semiconductor, MCIMX535DVV1C Datasheet - Page 19
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
MCIMX535DVV1C
Manufacturer Part Number
MCIMX535DVV1C
Description
IMX53 REV 2.1 COMM
Manufacturer
Freescale Semiconductor
Specifications of MCIMX535DVV1C
Rohs Compliant
YES
Core Size
32bit
Program Memory Size
288KB
Cpu Speed
1GHz
Digital Ic Case Style
BGA
No. Of Pins
529
Supply Voltage Range
1.25V To 1.35V
Operating Temperature Range
-20°C To +85°C
Msl
MSL 3 - 168 Hours
Embedded Interface Type
I2C, SPI, UART
Lead Free Status / Rohs Status
Supplier Unconfirmed
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCIMX535DVV1C
Manufacturer:
LRC
Quantity:
21 000
Company:
Part Number:
MCIMX535DVV1C
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCIMX535DVV1C
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MCIMX535DVV1CR2
Manufacturer:
FREESCALE
Quantity:
556
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4.1.2.2
Table 6
Freescale Semiconductor
5
6
1
2
3
4
5
6
7
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (at 200 ft/min)
Junction to Ambient (at 200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top (natural convection)
Calculated for just the i.MX53xD package, without the top mounted memory package.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
provides the PoP package thermal resistance data.
PoP Package Thermal Resistance
6
5
Rating
i.MX53xD Applications Processors for Consumer Products, Rev. 3
Table 6. PoP Package Thermal Resistance Data
2, 4
2, 4
2, 3
2, 3, 4
7
Single layer board
Single layer board
Four layer board
Four layer board
Board
(2s2p)
(2s2p)
(1s)
(1s)
—
—
—
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJA
θJA
θJB
θJC
JT
designed
<0.1
8.4
As
45
23
36
19
2
1
used for
Array of
Ground
Electrical Characteristics
Center
Pillars
<0.1
7.2
45
22
35
18
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
19
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