ERT-J0ER104J Panasonic - ECG, ERT-J0ER104J Datasheet - Page 11

• Manufacturer Part Number: ERT-J0ER104J
• Description: THERMISTOR NTC 100K OHM 5% 0402
• Manufacturer: Panasonic - ECG
• Series: ERT-Jr

Specifications of ERT-J0ER104J

• Resistance In Ohms @ 25°c: 100K
• Resistance Tolerance: ±5%
• B Value Tolerance: ±2%
• B25/50: 4250K
• B25/85: 4300K
• Operating Temperature: -40°C ~ 125°C
• Power - Max: 66mW
• Mounting Type: Surface Mount
• Package / Case: 0402 (1005 Metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• B0/50: -
• B25/75: -
• B25/100: -
• Lead Length: -
• Other names: ERTJ0ER104J; P13703TR

CLASSIFICATION
SUBJECT
3- 3.Selection of Soldering Flux
3- 4.Soldering
Note ;
3-4-1. Reflow soldering
(4) The closing dimensions of the positioning chucks shall be controlled. Maintenance and replacement of
(5) Maximum stroke of the nozzle shall be adjusted so that the maximum bending of PC board does not exceed
Soldering flux may seriously affect the performance of the Thermistors. The following shall be confirmed before
use.
(1) The soldering flux should have a halogen based content of 0.1 wt. % (converted to chlorine) or below.
(2) When applying water-soluble soldering flux, wash the Thermistors sufficiently because the soldering flux residue
(d) Adjust the vacuum nozzles so that their bottom dead center during mounting is not too low.
positioning chucks shall be performed regularly to prevent chipping or cracking of the Thermistors caused by
mechanical impact during positioning due to worn positioning chucks.
0.5mm at 90mm span. The PC board shall be supported by an adequate number of supporting pins.
Do not use soldering flux with strong acid.
on the surface of PC boards may deteriorate the insulation resistance on the Thermistors’ surface.
In reflow soldering, the mounted Thermistors/Components are generally heated and soldered by a thermal
conduction system such as an “Infrared radiation and hot blast soldering system” or a “Vapor Phase Soldering
System” (VPS)”.
Large temperature gradients such as the rapid heating and cooling which occurs during this process may cause
electrical failure and mechanical damage to the devices.
It is essential that the soldering process be controlled by the following recommended conditions and
precautions.
Single surface
mounting
Double surface
mounting
①Preheating
②Temp. rise
③Heating
④Peak
⑤Gradual cooling
Common Specification (Precautions for Use)
Multilayer Chip NTC Thermistors
SPECIFICATIONS
Separation
of solder
Preheating temp to Peak temp.
Peak temp. to 140 °C
NG mounting
140 to 180 °C
Temperature
260 °C max.
220 °C min.
Crack
Crack
The supporting pin does not necessarily have
to be positioned beneath the Thermistor
Supporting
pin
Supporting
pin
Recommended mounting
Period or Speed
60 to 120s
2 to 5 °C/s
1 to 4 °C/s
60 s max.
10 s max.
No.
PAGE
DATE
151S-ERTJ-SS03E
May 12, 2006
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