ETRX2HR-PA Telegesis Ltd, ETRX2HR-PA Datasheet - Page 2

• Manufacturer Part Number: ETRX2HR-PA
• Description: MODULE
• Manufacturer: Telegesis Ltd

Specifications of ETRX2HR-PA

• Module Applications: AMR, Building Automation, Wireless Sensor Network, M2M Industrial Controls
• Mcu Supported Families: EM250
• Processor Type: EM250
• Wireless Protocol: IEEE 802.15.4
• Data Rate: 250Kbps
• Module Interface: I2C, SPI, UART
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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1.1
1.2
1.2.1
2
2.1
2.1.1
2.2
2.3
2.4
2.5
3
4
4.1
4.1.1
4.1.2
4.1.3
5
6
6.1
6.2
7
8
9
10
11
11.1
12
13
13.1
13.2
14
15
15.1
16
©2009 Telegesis (UK) Ltd
INTRODUCTION................................................................................................................... 5
PRODUCT APPROVALS ..................................................................................................... 6
MODULE PINOUT ................................................................................................................ 9
HARDWARE DESCRIPTION ............................................................................................. 11
HARDWARE INTERFACE ................................................................................................. 12
FIRMWARE DESCRIPTION............................................................................................... 13
ABSOLUTE MAXIMUM RATINGS..................................................................................... 15
OPERATING CONDITIONS ............................................................................................... 15
DC ELECTRICAL CHARACTERISTICS ............................................................................ 17
A/D CONVERTER CHARACTERISTICS ........................................................................... 18
AC ELECTRICAL CHARACTERISTICS ............................................................................ 18
PHYSICAL DIMENSIONS .................................................................................................. 21
SOLDERING TEMPERATURE TIME PROFILE (FOR REFLOW SOLDERING) .............. 23
PRODUCT LABEL DRAWING ........................................................................................... 24
RECOMMENDED FOOTPRINT ......................................................................................... 25
RELIABILITY TESTS ......................................................................................................... 27
Hardware Description ........................................................................................................ 5
Hardware precautions........................................................................................................ 6
Unexpected start-up in bootloader mode........................................................................... 6
FCC Approvals................................................................................................................... 6
FCC Labelling Requirements............................................................................................. 7
European Certification ....................................................................................................... 7
Declarations of Conformity................................................................................................. 8
IEEE 802.15.4.................................................................................................................... 8
The ZigBee® Protocol ....................................................................................................... 8
Hardware Options ............................................................................................................ 11
On-board DC Regulator ................................................................................................... 11
On-board Reference Crystal ............................................................................................ 11
RF output pad .................................................................................................................. 11
Custom Firmware............................................................................................................. 13
Software Interface............................................................................................................ 14
TX Power Characteristics ................................................................................................ 20
For Leaded Solder ........................................................................................................... 23
For Lead-free Solder........................................................................................................ 23
Example carrier board...................................................................................................... 26
Table of Contents
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ETRX2PA Product Manual (Rev 1.06)
ETRX2PA