ETRX2HR-PA Telegesis Ltd, ETRX2HR-PA Datasheet - Page 23

• Manufacturer Part Number: ETRX2HR-PA
• Description: MODULE
• Manufacturer: Telegesis Ltd

Specifications of ETRX2HR-PA

• Module Applications: AMR, Building Automation, Wireless Sensor Network, M2M Industrial Controls
• Mcu Supported Families: EM250
• Processor Type: EM250
• Wireless Protocol: IEEE 802.15.4
• Data Rate: 250Kbps
• Module Interface: I2C, SPI, UART
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13 Soldering Temperature Time Profile (for reflow soldering)
13.1 For Leaded Solder
13.2 For Lead-free Solder
NB:
Maximum Reflow Cycles: 2
Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the
module on the bottom / underside of your pcb and re-flow).
©2009 Telegesis (UK) Ltd
Recommended temp. profile
for reflow soldering
Our used temp. profile
for reflow soldering
Temp
Temp
150°C – 190°C
.[°C]
.[°C]
150 ±10°C
230°C -250°C max.
Figure 7: Temperature Profile for Lead-free Solder
Figure 6: Temperature Profile for Lead Solder
235°C max.
220 ±5°C
200°C
220°C
- 23 -
90 ±30s
90 ±30s
ETRX2PA Product Manual (Rev 1.07)
30 +20/-10s
30 +20/-10s
10 ±1s
Time [s]
Time [s]
ETRX2PA