AM29LV320DT90EI AMD (ADVANCED MICRO DEVICES), AM29LV320DT90EI Datasheet - Page 53

• Manufacturer Part Number: AM29LV320DT90EI
• Description: Flash Memory IC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM29LV320DT90EI

• Memory Configuration: 4M X 8 / 2M X 16 Bit
• Package/case: 48-TSOP
• Supply Voltage Max: 3.6V
• Leaded Process Compatible: No
• Peak Reflow Compatible (260 C): No
• Access Time, Tacc: 90nS
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

REVISION SUMMARY
Revision A (November 1, 2000)
Initial release.
Revision A+1 (January 23, 2001)
Ordering Information
Corrected FBGA part number table to include
bottom boot part numbers.
Revision A+2 (February 1, 2001)
Connection Diagrams
Corrected FBGA ball matrix.
Revision A+3 (July 2, 2001)
Global
Changed data sheet status from Advance Infor-
mation to Preliminary.
Table
Corrected sector block size for SA60–SA62 to
3x64.
Sector/Sector Block Protection and
Unprotection
Noted that sectors are erased in parallel.
SecSi
Region
Noted changes for upcoming versions of these
devices: reduced SecSi Sector size, different
ESN location for top boot devices, and deletion
of SecSi Sector erase functionality. Current ver-
sions of these devices remain unaffected.
Revision B (July 12, 2002)
Global
Deleted Preliminary status from document.
Ordering Information
Deleted burn-in option.
Table
In the legend, corrected V
to 12.5 V.
SecSi
Region
Added description of SecSi Sector protection
verification.
Autoselect Command Sequence
Clarified description of function.
November 15, 2004
TM
TM
3, Top Boot SecSi
1, Am29LV320D Device Bus Operations
Sector (Secured Silicon) Flash Memory
Sector (Secured Silicon) Flash Memory
TM
Sector Addresses
HH
maximum voltage
Am29LV320D
Table
Corrected autoselect codes for SecSi Sector
Factory Protect.
Erase and Program Operations table
Corrected to indicate t
maximum value.
Revision B+1 (July 30, 2002)
Figure
Deleted fifth block in flowchart and modified
text in fourth block.
Revision C (October 25, 2002)
Distinctive Characteristics
Changed endurance from “write” to “erase” cy-
cles.
Connection Diagrams
Deleted ultrasonic reference and added pack-
age types to special package handling text.
Ordering Information
Added commercial temperature range and re-
moved extended temperature range.
SecSi Sector Flash Memory Region
Customer Lockable subsection: Deleted refer-
ence to alternate method of sector protection.
Command Definitions
Noted the following:
Autoselect, SecSi Sector, and CFI functions are
not available during a program or erase opera-
tion.
ACC and unlock bypass modes are not available
when the SecSi Sector is enabled.
Writing incorrect data or commands may place
the device in an unknown state. A reset com-
mand is then required.
AC Characteristics
Read-only Operations; Word/Byte Configura-
tion: Changed t
speed options.
DC Characteristics
Deleted I
table.
TSOP, SO, and BGA Package Capacitance
Added BGA capacitance to table.
14, Am29LV320D Command Definitions
3, SecSi Sector Protect Verify
ACC
and added I
DF
and t
BUSY
LR
FLQZ
specifications from
specification is a
to 16 ns for all
53