DSPIC33EP512MU810-I/PF Microchip Technology, DSPIC33EP512MU810-I/PF Datasheet - Page 29

• Manufacturer Part Number: DSPIC33EP512MU810-I/PF
• Description: 100 PINS, 512KB Flash, 52KB RAM, 60 MHz, USB, 2xCAN, 15 DMA 100 TQFP 14x14x1mm T
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33EPr

Specifications of DSPIC33EP512MU810-I/PF

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, QEI, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 83
• Program Memory Size: 512KB (170K x 24)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 24K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP
• Rohs Compliant: Yes
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.0
2.1
Getting started with the dsPIC33EPXXXMU806/810/814
and PIC24EPXXXGU810/814 families of 16-bit DSC and
microcontrollers requires attention to a minimal set of
device
development. The following is a list of pin names, which
must always be connected:
• All V
• All AV
• V
• MCLR pin (see
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
• V
 2009-2011 Microchip Technology Inc.
“Decoupling
is not used) (see
Capacitors”)
Capacitor Connection (V
Pin”)
Programming™ (ICSP™) and debugging purposes
(see
source is used (see
Oscillator
If the USB module is not used, V
connected to V
reference for ADC module is implemented
Note:
Note 1: This data sheet summarizes the features
CAP
USB
REF
dsPIC33EPXXXMU806/810/814 and PIC24EPXXXGU810/814
DD
Section 2.5 “ICSP
+/V
pin is used when utilizing the USB module.
DD
(see
2: Some registers and associated bits
pin
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS AND
MICROCONTROLLERS
Basic Connection Requirements
and V
REF
and AV
The AV
connected independent of the ADC
voltage reference source. The voltage
difference between AV
exceed 300 mV at any time during
operation or start-up.
of the dsPIC33EPXXXMU806/810/814
and PIC24EPXXXGU810/814 families of
devices. It is not intended to be a compre-
hensive reference source. To comple-
ment the information in this data sheet,
refer to the related section of the
“dsPIC33E/PIC24E Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com)
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
this data sheet for device-specific register
and bit information.
Section 2.3 “CPU Logic Filter
Pins”)
connections
- pins is used when external voltage
SS
Capacitors”)
DD
Section 2.4 “Master Clear (MCLR)
SS
pins (see
Section 2.2 “Decoupling
.
DD
pins (regardless if ADC module
Section 2.6 “External
and AV
Pins”)
before
CAP
Section 2.2
)”)
SS
DD
USB
proceeding
and V
pins must be
must be
DD
cannot
with
Preliminary
in
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
and AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation of
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
FIGURE 2-1:
Ceramic
V
0.1 µF (100 nF), 10-20V. This capacitor should be a
low-ESR and have resonance frequency in the
range of 20 MHz and higher. It is recommended to
use ceramic capacitors.
decoupling capacitors should be placed as close to
the pins as possible. It is recommended to place the
capacitors on the same side of the board as the
device. If space is constricted, the capacitor can be
placed on another layer on the PCB using a via;
however, ensure that the trace length from the pin to
the capacitor is within one-quarter inch (6 mm) in
length.
experiencing high frequency noise, above tens of
MHz, add a second ceramic-type capacitor in paral-
lel to the above described decoupling capacitor. The
value of the second capacitor can be in the range of
0.01 µF to 0.001 µF. Place this second capacitor
next to the primary decoupling capacitor. In
high-speed circuit designs, consider implementing a
decade pair of capacitances as close to the power
and ground pins as possible. For example, 0.1 µF in
parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first, and
then to the device pins. This ensures that the decou-
pling capacitors are first in the power chain. Equally
important is to keep the trace length between the
capacitor and the power pins to a minimum, thereby
reducing PCB track inductance.
0.1 µF
DD
R
C
SS
R1
Decoupling Capacitors
is required.
10
MCLR
V
V
SS
DD
RECOMMENDED
MINIMUM CONNECTION
dsPIC33EP
Ceramic
0.1 µF
DD
, V
DS70616E-page 29
SS
V
, V
V
DD
Ceramic
SS
Ceramic
0.1 µF
0.1 µF
USB
Ceramic
0.1 µF
, AV
DD