BAS21W,115 NXP Semiconductors, BAS21W,115 Datasheet - Page 8

• Manufacturer Part Number: BAS21W,115
• Description: DIODE SW 200V 200MA HS UMT3
• Manufacturer: NXP Semiconductors

Specifications of BAS21W,115

• Package / Case: SC-70-3, SOT-323-3
• Voltage - Forward (vf) (max) @ If: 1.25V @ 200mA
• Voltage - Dc Reverse (vr) (max): 250V
• Current - Average Rectified (io): 225mA (DC)
• Current - Reverse Leakage @ Vr: 100nA @ 200V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 50ns
• Capacitance @ Vr, F: 2pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 250 V
• Forward Continuous Current: 225 mA
• Max Surge Current: 625 mA
• Configuration: Single
• Recovery Time: 50 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 100 nA
• Maximum Power Dissipation: 200 mW
• Operating Temperature Range: - 55 C to + 150 C
• Maximum Diode Capacitance: 2 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934063268115

NXP Semiconductors
11. Soldering
BAS21W_SER_1
Product data sheet
Fig 8.
Fig 9.
3.65 2.1
2.35
Reflow soldering footprint SOT323 (SC-70)
Wave soldering footprint SOT323 (SC-70)
(3 )
0.6
1.425
(3 )
0.55
(3 )
Rev. 01 — 9 October 2009
3
2.65
1.85
2.575
4.6
1.325
2
1
(3 )
0.5
1.3
(2 )
09
1.8
BAS21W series
High-voltage switching diodes
Dimensions in mm
direction during soldering
Dimensions in mm
© NXP B.V. 2009. All rights reserved.
preferred transport
solder lands
solder resist
solder paste
occupied area
sot323_fr
solder lands
solder resist
occupied area
sot323_fw
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