PMEG4010EP,115 NXP Semiconductors, PMEG4010EP,115 Datasheet - Page 3

• Manufacturer Part Number: PMEG4010EP,115
• Description: SCHOTTKY RECT 40V 1.0A SOD-128
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PMEG4010EP,115

• Package / Case: SOD-128 Flat Leads
• Voltage - Forward (vf) (max) @ If: 490mV @ 1A
• Voltage - Dc Reverse (vr) (max): 40V
• Current - Average Rectified (io): 1A
• Current - Reverse Leakage @ Vr: 50µA @ 40V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Capacitance @ Vr, F: 130pF @ 1V, 1MHz
• Mounting Type: Surface Mount
• Product: Schottky Rectifiers
• Peak Reverse Voltage: 40 V
• Forward Continuous Current: 1 A
• Max Surge Current: 25 A
• Configuration: Single
• Forward Voltage Drop: 430 mV
• Maximum Reverse Leakage Current: 10 uA
• Maximum Power Dissipation: 625 mW
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Reverse Recovery Time (trr): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 934061482115

NXP Semiconductors
6. Thermal characteristics
PMEG4010EP_2
Product data sheet
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
Table 6.
[1]
[2]
[3]
[4]
[5]
[6]
Symbol
T
T
T
Symbol
R
R
j
amb
stg
th(j-a)
th(j-sp)
Device mounted on a ceramic PCB, Al
T
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses P
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Device mounted on a ceramic PCB, Al
Soldering point of cathode tab.
j
= 25 °C prior to surge.
Limiting values
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Parameter
junction temperature
ambient temperature
storage temperature
All information provided in this document is subject to legal disclaimers.
R
are a significant part of the total power losses.
Rev. 02 — 15 April 2010
…continued
2
2
O
O
3
3
, standard footprint.
, standard footprint.
Conditions
in free air
Conditions
1 A low V
F
MEGA Schottky barrier rectifier
[1][2]
[3]
[4]
[5]
[6]
PMEG4010EP
Min
-
−55
−65
Min
-
-
-
-
Typ
-
-
-
-
© NXP B.V. 2010. All rights reserved.
Max
150
+150
+150
Max
200
120
60
12
Unit
°C
°C
°C
2
2
.
.
Unit
K/W
K/W
K/W
K/W
3 of 14