MT48LC2M32B2TG-7 IT:G Micron Technology Inc, MT48LC2M32B2TG-7 IT:G Datasheet - Page 59
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MT48LC2M32B2TG-7 IT:G
Manufacturer Part Number
MT48LC2M32B2TG-7 IT:G
Description
DRAM Chip SDRAM 64M-Bit 2Mx32 3.3V 86-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC2M32B2TG-7_ITG.pdf
(69 pages)
Specifications of MT48LC2M32B2TG-7 IT:G
Density
64 Mb
Maximum Clock Rate
143 MHz
Package
86TSOP-II
Address Bus Width
13 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
17|8|5.5 ns
Operating Temperature
-40 to 85 °C
Organization
2Mx32
Address Bus
13b
Access Time (max)
17/8/5.5ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
160mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Not Compliant
Figure 41:
PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_2.fm - Rev. J 12/08 EN
COMMAND
BA0, BA1
DQM 0-3
A0-A9
CLK
CKE
A10
DQ
t CMS
t CKS
t AS
t AS
t AS
Alternating Bank Read Accesses
ACTIVE
BANK 0
T0
ROW
ROW
t CKH
t CMH
t AH
t AH
t AH
Notes:
t RCD - BANK 0
t RAS - BANK 0
t
t
RC - BANK 0
RRD
t CK
T1
NOP
1. For this example, BL = 4 and CL = 2.
2. A8 and A9 = “Don’t Care.”
ENABLE AUTO PRECHARGE
t CMS
t CL
COLUMN m 2
BANK 0
T2
READ
t CMH
t CH
CAS Latency - BANK 0
T3
NOP
t LZ
t AC
59
BANK 4
ACTIVE
T4
ROW
ROW
D
OUT
t OH
t AC
m
t RCD - BANK 4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
D
T5
OUT
NOP
m + 1
t OH
t AC
ENABLE AUTO PRECHARGE
COLUMN b 2
BANK 4
D
T6
READ
OUT
m + 2
t OH
t AC
CAS Latency - BANK 4
t RP - BANK 0
©2001 Micron Technology, Inc. All rights reserved.
D
T7
OUT
NOP
64Mb: x32 SDRAM
m + 3
t OH
Timing Diagrams
t AC
BANK 0
T8
ROW
ACTIVE
ROW
DON’T CARE
UNDEFINED
D
OUT
t RCD - BANK 0
t OH
t AC
b