MT48LC2M32B2TG-7 IT:G Micron Technology Inc, MT48LC2M32B2TG-7 IT:G Datasheet - Page 69
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MT48LC2M32B2TG-7 IT:G
Manufacturer Part Number
MT48LC2M32B2TG-7 IT:G
Description
DRAM Chip SDRAM 64M-Bit 2Mx32 3.3V 86-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC2M32B2TG-7_ITG.pdf
(69 pages)
Specifications of MT48LC2M32B2TG-7 IT:G
Density
64 Mb
Maximum Clock Rate
143 MHz
Package
86TSOP-II
Address Bus Width
13 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
17|8|5.5 ns
Operating Temperature
-40 to 85 °C
Organization
2Mx32
Address Bus
13b
Access Time (max)
17/8/5.5ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
160mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Not Compliant
Figure 51:
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although
PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_2.fm - Rev. J 12/08 EN
considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
90X Ø0.45 ±0.05
SEATING PLANE
11.20 ±0.10
0.10 C
90-Ball VFBGA (8mm x 13mm)
BALL A9
5.60 ±0.05
Notes:
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
C
0.65 ±0.05
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. Recommended pad size for PCB is 0.33mm ±0.025mm.
4. Topside part marking decoder can be found at:
www.micron.com/productsupport Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
3.20 ±0.05
0.025mm per side.
tools/fbga/decoder.
All other trademarks are the property of their respective owners.
8.00 ±0.10
6.40
C L
4.00 ±0.05
0.80 TYP
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
69
13.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
www.micron.com/support/designsupport/
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS: Ø0.40
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
BALL A1 ID