LFEC10E-3FN256C LATTICE SEMICONDUCTOR, LFEC10E-3FN256C Datasheet - Page 35

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LFEC10E-3FN256C

Manufacturer Part Number
LFEC10E-3FN256C
Description
FPGA LatticeEC Family 10200 Cells 340MHz 130nm (CMOS) Technology 1.2V 256-Pin FBGA
Manufacturer
LATTICE SEMICONDUCTOR
Datasheet

Specifications of LFEC10E-3FN256C

Package
256FBGA
Family Name
LatticeEC
Device Logic Units
10200
Maximum Internal Frequency
340 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
195
Ram Bits
282624
In System Programmability
Yes

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFEC10E-3FN256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Architecture
Lattice Semiconductor
LatticeECP/EC Family Data Sheet
be shifted in and loaded directly onto test nodes, or test data to be captured and shifted out for verification. The test
access port consists of dedicated I/Os: TDI, TDO, TCK and TMS. The test access port has its own supply voltage
V
and can operate with LVCMOS3.3, 2.5, 1.8, 1.5 and 1.2 standards.
CCJ
For more details on boundary scan test, please see information regarding additional technical documentation at
the end of this data sheet.
Device Configuration
All LatticeECP/EC devices contain two possible ports that can be used for device configuration. The test access
port (TAP), which supports bit-wide configuration, and the sysCONFIG port that supports both byte-wide and serial
configuration.
The TAP supports both the IEEE Std. 1149.1 Boundary Scan specification and the IEEE Std. 1532 In-System Con-
figuration specification. The sysCONFIG port is a 20-pin interface with six of the I/Os used as dedicated pins and
the rest being dual-use pins (please refer to TN1053 for more information about using the dual-use pins as general
purpose I/O). There are four configuration options for LatticeECP/EC devices:
1. Industry standard SPI memories.
2. Industry standard byte wide flash and ispMACH 4000 for control/addressing.
3. Configuration from system microprocessor via the configuration bus or TAP.
4. Industry standard FPGA board memory.
On power-up, the FPGA SRAM is ready to be configured with the sysCONFIG port active. The IEEE 1149.1 serial
mode can be activated any time after power-up by sending the appropriate command through the TAP port. Once a
configuration port is selected, that port is locked and another configuration port cannot be activated until the next
power-up sequence.
For more information about device configuration, please see the list of technical documentation at the end of this
data sheet.
Internal Logic Analyzer Capability (ispTRACY)
All LatticeECP/EC devices support an internal logic analyzer diagnostic feature. The diagnostic features provide
capabilities similar to an external logic analyzer, such as programmable event and trigger condition and deep trace
memory. This feature is enabled by Lattice’s ispTRACY. The ispTRACY utility is added into the user design at com-
pile time.
For more information about ispTRACY, please see information regarding additional technical documentation at the
end of this data sheet.
External Resistor
LatticeECP/EC devices require a single external, 10K ohm +/- 1% value between the XRES pin and ground.
Device configuration will not be completed if this resistor is missing. There is no boundary scan register on the
external resistor pad.
2-32

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