LFEC10E-3FN256C LATTICE SEMICONDUCTOR, LFEC10E-3FN256C Datasheet - Page 69

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LFEC10E-3FN256C

Manufacturer Part Number
LFEC10E-3FN256C
Description
FPGA LatticeEC Family 10200 Cells 340MHz 130nm (CMOS) Technology 1.2V 256-Pin FBGA
Manufacturer
LATTICE SEMICONDUCTOR
Datasheet

Specifications of LFEC10E-3FN256C

Package
256FBGA
Family Name
LatticeEC
Device Logic Units
10200
Maximum Internal Frequency
340 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
195
Ram Bits
282624
In System Programmability
Yes

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFEC10E-3FN256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Lattice Semiconductor
PICs and DDR Data (DQ) Pins Associated with the DDR Strobe (DQS) Pin
P[Edge] [n-4]
P[Edge] [n-3]
P[Edge] [n-2]
P[Edge] [n-1]
P[Edge] [n]
P[Edge] [n+1]
P[Edge] [n+2]
P[Edge] [n+3]
Notes:
1. “n” is a Row/Column PIC number
2. The DDR interface is designed for memories that support one DQS strobe per eight bits of
3. PIC numbering definitions are provided in the “Signal Names” column of the Signal Descrip-
data. In some packages, all the potential DDR data (DQ) pins may not be available.
tions table.
PICs Associated
with DQS Strobe
PIO Within PIC
4-3
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
LatticeECP/EC Family Data Sheet
DDR Strobe (DQS) and
Data (DQ) Pins
[Edge]DQSn
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
Pinout Information

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