PIC16LF1906-E/MV Microchip Technology, PIC16LF1906-E/MV Datasheet - Page 244

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PIC16LF1906-E/MV

Manufacturer Part Number
PIC16LF1906-E/MV
Description
14KB Flash, 512B RAM, LCD, 11x10b ADC, EUSART, NanoWatt XLP 28 UQFN 4x4x0.5mm TU
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheet

Specifications of PIC16LF1906-E/MV

Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
LIN, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
14KB (8K x 14)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-UFQFN Exposed Pad
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC16LF1904/6/7
22.6
DS41569A-page 244
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
P
= Junction Temperature
JMAX
= Ambient Temperature
PD
DER
is current to run the chip alone without driving any load on the output pins.
JA
JC
I
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
 +125°C
Preliminary
Typ.
27.5
31.4
150
60
80
90
24
24
24
Units
 C/W
 C/W
 C/W
 C/W
 C/W
 C/W
 C/W
 C/W
 C
W
W
W
W
PD = P
P
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin UQFN 4x4mm package
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin UQFN 4x4mm package
P
P
INTERNAL
I
DER
/
O
=  (I
= PD
INTERNAL
 2011 Microchip Technology Inc.
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) +  (I
- T
DD
I
/
O
A
(1)
)/ 
OH
JA
(2)
* (V
DD
- V
OH
))

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