PIC32MX210F016B-I/SO Microchip Technology, PIC32MX210F016B-I/SO Datasheet - Page 252

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PIC32MX210F016B-I/SO

Manufacturer Part Number
PIC32MX210F016B-I/SO
Description
PIC32, 16KB Flash, 4KB RAM, 40 MHz, USB, CTMU, 4 DMA 28 SOIC .300in TUBE
Manufacturer
Microchip Technology
Datasheet
PIC32MX1XX/2XX
TABLE 29-11: DC CHARACTERISTICS: PROGRAM MEMORY
DS61168D-page 252
DC CHARACTERISTICS
D130
D131
D132
D134
D135
D136
D137
Note 1:
Param.
No.
2:
3:
E
V
V
T
I
T
T
T
T
Symbol
DDP
CE
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated.
The minimum SYSCLK for row programming is 4 MHz. Care should be taken to minimize bus activities
during row programming, such as suspending any memory-to-memory DMA operations. If heavy bus loads
are expected, selecting Bus Matrix Arbitration mode 2 (rotating priority) may be necessary. The default
Arbitration mode is mode 1 (CPU has lowest priority).
Refer to the “PIC32 Flash Programming Specification” (DS61145) for operating conditions during
programming and erase cycles.
RETD
WW
RW
PE
P
PR
PEW
Program Flash Memory
Cell Endurance
V
V
Characteristic Retention
Supply Current during
Programming
Word Write Cycle Time
Row Write Cycle Time
(Note 2)
(128 words per row)
Page Erase Cycle Time
Chip Erase Cycle Time
DD
DD
for Read
for Erase or Write
Characteristics
20,000
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
Min.
2.3
2.3
20
20
20
80
3
Preliminary
Typical
4.5
10
(1)
Max.
3.6
3.6
40
-40°C ≤ T
-40°C ≤ T
(3)
Units
Year Provided no other specifications
E/W
mA
ms
ms
ms
µs
V
V
A
A
© 2011-2012 Microchip Technology Inc.
≤ +85°C for Industrial
≤ +105°C for V-temp
are violated
Conditions

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