TDA6108JF NXP Semiconductors, TDA6108JF Datasheet - Page 13

• Manufacturer Part Number: TDA6108JF
• Manufacturer: NXP Semiconductors

Specifications of TDA6108JF

• Power Supply Requirement: Single
• Mounting: Through Hole
• Lead Free Status / RoHS Status: Not Compliant

Philips Semiconductors
PACKAGE OUTLINE
1999 Oct 29
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
Triple video output amplifier
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT111-1
18.5
17.8
A
max.
3.7
A
2
Z
8.7
8.0
A
3
1
15.5
15.1
A
4
IEC
1.40
1.14
b
P
b
2
pin 1 index
0.67
0.50
b
1
e
1.40
1.14
b
2
JEDEC
0.48
0.38
P
D
c
q
D
1
1
REFERENCES
21.8
21.4
D
(1)
0
21.4
20.7
D
1
b
6.48
6.20
E
(1)
b
EIAJ
13
1
scale
2.54
5
e
w
9
2.54
e
M
2
q
1
3.9
3.4
10 mm
L
q
L
2
2.75
2.50
P
A
4
3.4
3.2
P
A
1
3
1.75
1.55
A
Q
PROJECTION
EUROPEAN
15.1
14.9
q
c
4.4
4.2
q
1
Q
Product specification
A
e
5.9
5.7
TDA6108JF
q
2
2
2
0.25
ISSUE DATE
w
E
92-11-17
95-03-11
max.
Z
1.0
SOT111-1
(1)
65
55
o
o