TDA6108JF NXP Semiconductors, TDA6108JF Datasheet - Page 13
TDA6108JF
Manufacturer Part Number
TDA6108JF
Description
Manufacturer
NXP Semiconductors
Datasheet
1.TDA6108JF.pdf
(16 pages)
Specifications of TDA6108JF
Power Supply Requirement
Single
Mounting
Through Hole
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA6108JF
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Philips Semiconductors
PACKAGE OUTLINE
1999 Oct 29
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
Triple video output amplifier
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT111-1
18.5
17.8
A
max.
3.7
A
2
Z
8.7
8.0
A
3
1
15.5
15.1
A
4
IEC
1.40
1.14
b
P
b
2
pin 1 index
0.67
0.50
b
1
e
1.40
1.14
b
2
JEDEC
0.48
0.38
P
D
c
q
D
1
1
REFERENCES
21.8
21.4
D
(1)
0
21.4
20.7
D
1
b
6.48
6.20
E
(1)
b
EIAJ
13
1
scale
2.54
5
e
w
9
2.54
e
M
2
q
1
3.9
3.4
10 mm
L
q
L
2
2.75
2.50
P
A
4
3.4
3.2
P
A
1
3
1.75
1.55
A
Q
PROJECTION
EUROPEAN
15.1
14.9
q
c
4.4
4.2
q
1
Q
Product specification
A
e
5.9
5.7
TDA6108JF
q
2
2
2
0.25
ISSUE DATE
w
E
92-11-17
95-03-11
max.
Z
1.0
SOT111-1
(1)
65
55
o
o