TDA6108JF NXP Semiconductors, TDA6108JF Datasheet - Page 4

• Manufacturer Part Number: TDA6108JF
• Manufacturer: NXP Semiconductors

Specifications of TDA6108JF

• Power Supply Requirement: Single
• Mounting: Through Hole
• Lead Free Status / RoHS Status: Not Compliant

Philips Semiconductors
THERMAL CHARACTERISTICS
Note
1. An external heatsink is necessary.
1999 Oct 29
handbook, halfpage
R
R
R
th(j-a)
th(j-fin)
th(h-a)
Triple video output amplifier
(1) Infinite heatsink.
(2) No heatsink.
SYMBOL
P tot
(W)
8
6
4
2
0
20
Fig.3 Power derating curves.
20
thermal resistance from junction to ambient
thermal resistance from junction to fin
thermal resistance from heatsink to ambient
(1)
(2)
60
100
PARAMETER
140
T amb ( C)
MGL322
180
4
Thermal protection
The internal thermal protection circuit gives a decrease of
the slew rate at high temperatures: 10% decrease at
130 C and 30% decrease at 145 C (typical values on the
spot of the thermal protection circuit).
handbook, halfpage
note 1
Fig.4 Equivalent thermal resistance network.
CONDITIONS
outputs
fin
5 K/W
6 K/W
thermal protection circuit
MGK279
VALUE
56
11
10
Product specification
TDA6108JF
UNIT
K/W
K/W
K/W