MT47H32M16HR-37E:F Micron Technology Inc, MT47H32M16HR-37E:F Datasheet - Page 18
![](/photos/31/34/313419/mfg557-84-fbga_sml.jpg)
MT47H32M16HR-37E:F
Manufacturer Part Number
MT47H32M16HR-37E:F
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H32M16HR-37EF.pdf
(132 pages)
Specifications of MT47H32M16HR-37E:F
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
500ps
Maximum Clock Rate
533MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
205mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H32M16HR-37E:F
Manufacturer:
MICRON
Quantity:
5 373
- Current page: 18 of 132
- Download datasheet (10Mb)
Packaging
Package Dimensions
Figure 8: 84-Ball FBGA (8mm x 12.5mm) – x16
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
Solder ball material:
SAC305
3% Ag, 0.5% Cu)
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD
ball pads.
Seating
84X Ø0.45
plane
0.12 A
(96.5% Sn,
11.2 CTR
0.8 TYP
.
Notes:
A
Nonconductive overmold
9 8
1. All dimensions are in millimeters.
2. Solder ball material for this package is also available as leaded eutectic (62% Sn, 36%
Pb, 2% Ag).
7
1.8 CTR
6.4 CTR
TYP
8 ±0.1
0.8
3 2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
18
Ball A1 ID
12.5 ±0.1
0.8 ±0.05
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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