SLE 4406SPE D Infineon Technologies, SLE 4406SPE D Datasheet - Page 4

• Manufacturer Part Number: SLE 4406SPE D
• Manufacturer: Infineon Technologies

Specifications of SLE 4406SPE D

• Operating Temperature (min): -40C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Not Compliant

Table 1
Type
SLE 4406SP C
SLE 4406SP D
SLE 4406SP M3
SLE 4406SP MFC3
SLE 4406SPE C
SLE 4406SPE D
SLE 4406SPE M3
SLE 4406SPE MFC3
Pin Description
Figure 1
Figure 2
1)
2)
Short Product Information
Available as a Flip Chip Module (MFC3), wire-bonded module (M3) for embedding in plastic cards or as a die on
unsawn (C) / sawn wafer (D) for customer packaging
FCoS™ Flip Chip on Substrate
Pin Configuration Wire-bonded Module M3.2 (top view)
Pin Configuration Flip Chip Module MFC3.1 (top view)
Ordering Information
Package
Die (on Wafer)
Die (on Wafer)
T-M3.2-6
S-MFC3.1-6-1
Die (on Wafer)
Die (on Wafer)
T-M3.2-6
S-MFC3.1-6-1
1)
Remark
unsawn
sawn
FCoS™
unsawn
sawn
FCoS™
4 / 6
2)
2)
Access of 3rd byte
Data of 3rd byte are programmed by
Infineon exclusively
Data of 3rd byte are programmed by the
card manufacturer at personalisation
SLE 4406SPE
SLE 4406SP
2008-10-14