MC9S08SH16CTL Freescale, MC9S08SH16CTL Datasheet - Page 17

• Manufacturer Part Number: MC9S08SH16CTL
• Manufacturer: Freescale

Specifications of MC9S08SH16CTL

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: SCI/SPI
• Total Internal Ram Size: 1KB
• # I/os (max): 23
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 16-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 28
• Package Type: TSSOP
• Program Memory Type: Flash
• Program Memory Size: 16KB
• Lead Free Status / RoHS Status: Compliant

Section Number
17.3 On-Chip Debug System (DBG) .................................................................................................... 275
17.4 Register Definition ........................................................................................................................ 279
A.1 Introduction ....................................................................................................................................287
A.2 Parameter Classification.................................................................................................................287
A.3 Absolute Maximum Ratings...........................................................................................................287
A.4 Thermal Characteristics..................................................................................................................289
A.5 ESD Protection and Latch-Up Immunity .......................................................................................291
A.6 DC Characteristics..........................................................................................................................292
A.7 Supply Current Characteristics.......................................................................................................296
A.8 External Oscillator (XOSC) Characteristics ..................................................................................300
A.9 Internal Clock Source (ICS) Characteristics ..................................................................................301
A.10 Analog Comparator (ACMP) Electricals .......................................................................................302
A.11 ADC Characteristics.......................................................................................................................303
A.12 AC Characteristics..........................................................................................................................306
A.13 Flash Specifications........................................................................................................................312
A.14 EMC Performance..........................................................................................................................313
B.1 Ordering Information .....................................................................................................................315
B.2 Mechanical Drawings.....................................................................................................................316
Freescale Semiconductor
17.2.2 Communication Details .................................................................................................. 268
17.2.3 BDC Commands ............................................................................................................. 272
17.2.4 BDC Hardware Breakpoint............................................................................................. 274
17.3.1 Comparators A and B...................................................................................................... 275
17.3.2 Bus Capture Information and FIFO Operation ............................................................... 275
17.3.3 Change-of-Flow Information .......................................................................................... 276
17.3.4 Tag vs. Force Breakpoints and Triggers ......................................................................... 276
17.3.5 Trigger Modes................................................................................................................. 277
17.3.6 Hardware Breakpoints .................................................................................................... 279
17.4.1 BDC Registers and Control Bits ..................................................................................... 279
17.4.2 System Background Debug Force Reset Register (SBDFR) .......................................... 281
17.4.3 DBG Registers and Control Bits..................................................................................... 282
A.12.1 Control Timing ................................................................................................................306
A.12.2 TPM/MTIM Module Timing ...........................................................................................308
A.12.3 SPI....................................................................................................................................309
A.14.1 Radiated Emissions..........................................................................................................313
A.14.2 Conducted Transient Susceptibility .................................................................................313
B.1.1 Device Numbering Scheme .............................................................................................315
Ordering Information and Mechanical Drawings
Electrical Characteristics
MC9S08SH32 Series Data Sheet, Rev. 2
Appendix A
Appendix B
PRELIMINARY
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