STM32F207VET6 STMicroelectronics, STM32F207VET6 Datasheet - Page 161

• Manufacturer Part Number: STM32F207VET6
• Description: MCU ARM 512KB FLASH 100LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F207VET6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, Ethernet, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 82
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 132K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LFQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-11171

STM32F205xx, STM32F207xx
Table 89.
22-Apr-2011
Date
Document revision history (continued)
(continued)
Revision
6
Updated
well as
mode, code with data processing running from Flash memory (ART
accelerator disabled)
consumption in Run mode, code with data processing running from
Flash memory (ART accelerator enabled) or
Figure
Updated
mode, and added
Updated
mode. Added
in Stop
Updated
Standby mode
consumptions in VBAT
Updated
Table 21: Peripheral current
Updated t
power mode wakeup
Maximum f
High-speed external user clock
Updated C and g
characteristics. Updated R
oscillator characteristics (fLSE = 32.768
Added
HSI oscillator
temperature.
Updated f
characteristics. Added
Table 29: Main PLL
jitter, IDD
maximum values.
Table 30: PLLI2S (audio PLL)
t
minimum and maximum values.
Added
Updated
Flash memory programming
and added
Modified
Updated
in
to V
Updated
Added
Modified maximum frequency values and conditions in
AC
Updated t
APB1
TIMx connected to the APB2
LOCK
Section : Electromagnetic Interference
Doc ID 15818 Rev 6
characteristics.
ESD(HBM)
, jitter, IDD
domain. Modified t
22,
Note 1
Note 1
Section 5.3.15: I/O current injection
Table 15: Typical and maximum current consumption in Run
mode.
Table 17: Typical and maximum current consumption in Sleep
Table 18: Typical and maximum current consumptions in Stop
Typical and maximum current consumption
Table 19: Typical and maximum current consumptions in
On-chip peripheral current consumption
Table 32: Flash memory
Figure 37: Recommended NRST pin
Table 37: EMI characteristics
Table 41: I/O static
(PLL)
WUSTDBY
LSI
res(TIM)
Figure
HSE_ext
Note 1
, t
in
characteristics. Added
Figure 27: Typical current consumption vs temperature
and IDD
su(LSI)
and updated ACC
in
and
Table 38: ESD absolute maximum
(PLLI2S)
Table 31: SSCG parameters
m
in
23, and
Figure 25
and minimum t
in
in
and t
Table 20: Typical and maximum current
Table 45: Characteristics of TIMx connected to the
characteristics: removed note 1, updated t
and IDD
Table 34: Flash memory programming with
timings.
and
Table 25: HSE 4-26 MHz oscillator
A(PLL)
Figure 33: ACCLSI versus temperature
mode.
and IDD
WUSTOP
res(TIM)
Table 16: Typical and maximum current
Figure
F
, I
, added
consumption.
and
characteristics.
and added
(LSI)
2
domain.
characteristics: removed note 1, updated
, g
Changes
characteristics.
, and added
A(PLLI2S)
and f
HSI
Figure
m
24.
w(HSE)
in
characteristics. Modified
, and t
, IDD
Table 28: LSI oscillator
Note 2
Figure 32: ACCHSI versus
EXT
and EMI monitoring conditions
26.
values updated in
, added
Note 2
kHz).
su(LSE)
(HSI
(EMI). Added
Table 46: Characteristics of
characteristics.
for f
, and t
Note 3
RAM. Added
constraint.
protection.
PLL_IN
in
for t
Note 3
conditions and
Table 26: LSE
ratings.
su(HSI)
prog
in
Revision history
conditions, as
Table 22: Low-
minimum and
. Updated t
Table 43: I/O
Note 2
for f
in
Figure
Table 23:
Table 33:
Table 27:
PLLI2S_IN
LOCK
related
161/163
VPP.
21,
prog
,