MAX197BENI+ Maxim Integrated Products, MAX197BENI+ Datasheet - Page 15

• Manufacturer Part Number: MAX197BENI+
• Description: IC DAS 12BIT SNGL 28-DIP
• Manufacturer: Maxim Integrated Products
• Type: Data Acquisition System (DAS)r

Specifications of MAX197BENI+

• Resolution (bits): 12 b
• Sampling Rate (per Second): 100k
• Data Interface: Parallel
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 28-DIP (0.300", 7.62mm)
• Number Of Adc Inputs: 8
• Architecture: SAR
• Conversion Rate: 100 KSPs
• Resolution: 12 bit
• Input Type: Voltage
• Voltage Reference: Internal 4.096 V or External
• Supply Voltage (max): 5 V
• Maximum Power Dissipation: 1143 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Input Voltage: 10 V
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Output data coding for the MAX197 is binary in unipo-
lar mode with 1LSB = (FS / 4096) and two’s-comple-
ment binary in bipolar mode with 1LSB = ((2 x
4096). Code transitions occur halfway between succes-
sive-integer LSB values. Figures 10 and 11 show the
input/output (I/O) transfer functions for unipolar and
bipolar operations, respectively. For full-scale (FS) val-
ues, see Table 1.
Careful printed circuit board layout is essential for best
system performance. For best performance, use a
ground plane. To reduce crosstalk and noise injection,
keep analog and digital signals separate. Digital
ground lines can run between digital signal lines to
minimize interference. Connect analog grounds and
DGND in a star configuration to AGND. For noise-free
operation, ensure the ground return from AGND to the
supply ground is low impedance and as short as possi-
ble. Connect the logic grounds directly to the supply
ground. Bypass V
to AGND to minimize high- and low-frequency fluctua-
tions. If the supply is excessively noisy, connect a 5Ω
resistor between the supply and V
Figure 12.
Figure 12. Power-Supply Grounding Connection
* OPTIONAL
** CONNECT AGND AND DGND WITH A GROUND PLANE OR A SHORT TRACE
R* = 5Ω
Single +5V, 12-Bit DAS with 8+4 Bus Interface
+5V
V
DD
Layout, Grounding, and Bypassing
4.7µF
0.1µF
AGND
MAX197
______________________________________________________________________________________
DD
with 0.1µF and 4.7µF capacitors
**
SUPPLY
Multi-Range (±10V, ±5V, +10V, +5V),
Transfer Function
DGND
DD
, as shown in
+5V
CIRCUITRY
DIGITAL
GND
DGND
|
FS
|
) /
TRANSISTOR COUNT: 2956
SUBSTRATE CONNECTED TO GND
** Contact factory for availability and processing to MIL-STD-883.
___________________Chip Topography
SHDN
HBEN
_Ordering Information (continued)
MAX197AENI
MAX197BENI
MAX197AEWI
MAX197BEWI
MAX197AEAI
MAX197BEAI
MAX197AMYI
MAX197BMYI
RD
D7
D6
D5
D4
D3
PART
D2
WR
D1
CS
D0
-55°C to +125°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-55°C to +125°C
TEMP RANGE
CLK
(3.659mm)
0.144"
AGND
DGND
V
DD
CH0
CH1
V
CC
PIN-PACKAGE
28 Narrow Plastic DIP
28 Narrow Plastic DIP
28 Wide SO
28 Wide SO
28 SSOP
28 SSOP
28 Narrow Ceramic SB**
28 Narrow Ceramic SB**
REF
REFADJ
INT
CH7
CH6
CH5
CH4
CH3
CH2
(5.870mm)
0.231"
15