MT47H32M8BP-3:B Micron Technology Inc, MT47H32M8BP-3:B Datasheet - Page 5

• Manufacturer Part Number: MT47H32M8BP-3:B
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M8BP-3:B

• Organization: 32Mx8
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 190mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

List of Tables
Table 1: Key Timing Parameters ...................................................................................................................... 1
Table 2: Addressing ......................................................................................................................................... 2
Table 3: FBGA 60-Ball – x4, x8 and 84-Ball – x16 Descriptions .......................................................................... 15
Table 4: Input Capacitance ............................................................................................................................ 19
Table 5: Absolute Maximum DC Ratings ........................................................................................................ 20
Table 6: Temperature Limits .......................................................................................................................... 21
Table 7: Thermal Impedance ......................................................................................................................... 22
Table 8: General I
Table 9: I
Table 10: DDR2 I
Table 11: AC Operating Specifications and Conditions .................................................................................... 26
Table 12: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 37
Table 13: ODT DC Electrical Characteristics ................................................................................................... 38
Table 14: Input DC Logic Levels ..................................................................................................................... 39
Table 15: Input AC Logic Levels ..................................................................................................................... 39
Table 16: Differential Input Logic Levels ........................................................................................................ 40
Table 17: Differential AC Output Parameters .................................................................................................. 42
Table 18: Output DC Current Drive ................................................................................................................ 42
Table 19: Output Characteristics .................................................................................................................... 43
Table 20: Full Strength Pull-Down Current (mA) ............................................................................................ 44
Table 21: Full Strength Pull-Up Current (mA) ................................................................................................. 45
Table 22: Reduced Strength Pull-Down Current (mA) ..................................................................................... 46
Table 23: Reduced Strength Pull-Up Current (mA) .......................................................................................... 47
Table 24: Input Clamp Characteristics ........................................................................................................... 48
Table 25: Address and Control Balls ............................................................................................................... 49
Table 26: Clock, Data, Strobe, and Mask Balls ................................................................................................. 49
Table 27: AC Input Test Conditions ................................................................................................................ 50
Table 28: DDR2-400/533 Setup and Hold Time Derating Values (
Table 29: DDR2-667/800/1066 Setup and Hold Time Derating Values (
Table 30: DDR2-400/533
Table 31: DDR2-667/800/1066
Table 32: Single-Ended DQS Slew Rate Derating Values Using
Table 33: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
Table 36: Truth Table – DDR2 Commands ..................................................................................................... 64
Table 37: Truth Table – Current State Bank n – Command to Bank n ............................................................... 65
Table 38: Truth Table – Current State Bank n – Command to Bank m .............................................................. 67
Table 39: Minimum Delay with Auto Precharge Enabled ................................................................................. 68
Table 40: Burst Definition .............................................................................................................................. 72
Table 41: READ Using Concurrent Auto Precharge ......................................................................................... 93
Table 42: WRITE Using Concurrent Auto Precharge ........................................................................................ 99
Table 43: Truth Table – CKE ......................................................................................................................... 114
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
DD7
Timing Patterns (4-Bank Interleave READ Operation) ................................................................ 23
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Specifications and Conditions ......................................................................................... 24
Parameters .................................................................................................................... 23
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DH Derating Values with Differential Strobe ..................................................... 56
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DH Derating Values with Differential Strobe ............................................ 57
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
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256Mb: x4, x8, x16 DDR2 SDRAM
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) at DDR2-667 ..................................... 58
) at DDR2-533 ..................................... 59
) at DDR2-400 ..................................... 59
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IH) ................................................... 52
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.................................................. 58
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