MT49H32M18CHT-25:A Micron Technology Inc, MT49H32M18CHT-25:A Datasheet - Page 14

• Manufacturer Part Number: MT49H32M18CHT-25:A
• Manufacturer: Micron Technology Inc
• Type: RLDRAMr

Specifications of MT49H32M18CHT-25:A

• Organization: 32Mx18
• Address Bus: 24b
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 675mA
• Pin Count: 144
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Package Dimensions
Figure 5:
PDF: 09005aef815b2df8/Source: 09005aef811ba111
576Mb_RLDRAM_II_SIO_D2.fm - Rev. F 6/09 EN
Solder ball material:
Eutectic (62% Sn,
36% Pb, 2% Ag) or
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.4 SMD
ball pads.
144X Ø0.51
Seating
plane
17 CTR
0.12 A
144-Ball µBGA
1 TYP
A
12 11 10 9
10.7 CTR
11 ±0.15
0.8 TYP
8.8 CTR
10º TYP
576Mb: x9, x18 2.5V Vext, 1.8V Vdd, HSTL, SIO, RLDRAM II
4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
0.68 ±0.1
18.5 ±0.15
Ball A1 ID
14
Micron Technology, Inc., reserves the right to change products or specifications without notice.
17.9 CTR
0.34 MIN
1.2 MAX
0.44 ±0.05
Package Dimensions
©2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID