XCS30XL-4VQ100I Xilinx Inc, XCS30XL-4VQ100I Datasheet - Page 42

• Manufacturer Part Number: XCS30XL-4VQ100I
• Description: IC FPGA 3.3V I-TEMP HP 100VQFP
• Manufacturer: Xilinx Inc
• Series: Spartan™-XLr

Specifications of XCS30XL-4VQ100I

• Number Of Logic Elements/cells: 1368
• Number Of Labs/clbs: 576
• Total Ram Bits: 18432
• Number Of I /o: 77
• Number Of Gates: 30000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 100-TQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Spartan and Spartan-XL FPGA Families Data Sheet
Spartan Family Detailed Specifications
Definition of Terms
In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as
follows:
Advance: Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or families. Values
are subject to change. Use as estimates, not for production.
Preliminary: Based on preliminary characterization. Further changes are not expected.
Unmarked: Specifications not identified as either Advance or Preliminary are to be considered Final.
Notwithstanding the definition of the above terms, all specifications are subject to change without notice.
Except for pin-to-pin input and output parameters, the AC parameter delay specifications included in this document are
derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction
temperature conditions. The parameters included are common to popular designs and typical applications.
Spartan Family Absolute Maximum Ratings
Spartan Family Recommended Operating Conditions
42
Notes:
1.
2.
Notes:
1.
2.
3.
4.
Symbol
Symbol
T
V
V
V
V
At junction temperatures above those listed as Recommended Operating Conditions, all delay parameters increase by 0.35% per °C.
Input and output measurement thresholds are: 1.5V for TTL and 2.5V for CMOS.
STG
T
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
Maximum DC overshoot (above V
achieve.
Maximum AC (during transitions) conditions are as follows; the device pins may undershoot to –2.0V or overshoot to +7.0V, provided
this overshoot or undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.
For soldering guidelines, see the Package Infomation on the Xilinx website.
V
T
V
CC
TS
IN
J
CC
IN
IH
IL
Supply voltage relative to GND
Input voltage relative to GND
Voltage applied to 3-state output
Storage temperature (ambient)
Junction temperature
Supply voltage relative to GND, T
Supply voltage relative to GND, T
High-level input voltage
Low-level input voltage
Input signal transition time
CC
(2)
(2)
) or undershoot (below GND) must be limited to either 0.5V or 10 mA, whichever is easier to
(2,3)
Description
(2,3)
Description
J
J
= –40°C to +100°C
= 0°C to +85°C
www.xilinx.com
(1)
Plastic packages
(1)
Commercial
Industrial
TTL inputs
CMOS inputs
TTL inputs
CMOS inputs
–0.5 to V
–0.5 to V
–0.5 to +7.0
–65 to +150
4.75
70%
Min
4.5
2.0
Value
0
0
-
+125
DS060 (v1.8) June 26, 2008
CC
CC
Product Specification
+0.5
+0.5
100%
5.25
20%
Max
V
250
5.5
0.8
CC
Units
°C
°C
V
V
V
Units
V
V
ns
V
V
V
V
CC
CC
R