CY7C64713-56LFXC Cypress Semiconductor Corp, CY7C64713-56LFXC Datasheet - Page 53

• Manufacturer Part Number: CY7C64713-56LFXC
• Description: IC MCU USB EZ FX1 16KB 56VQFN
• Manufacturer: Cypress Semiconductor Corp
• Series: EZ-USB FX1™r

Specifications of CY7C64713-56LFXC

• Applications: USB Microcontroller
• Core Processor: 8051
• Program Memory Type: ROMless
• Controller Series: CY7C647xx
• Ram Size: 16K x 8
• Interface: I²C, USB, USART
• Number Of I /o: 24
• Voltage - Supply: 3.15 V ~ 3.45 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 56-VQFN Exposed Pad, 56-HVQFN, 56-SQFN, 56-DHVQFN
• Data Bus Width: 8 bit
• Data Ram Size: 16 KB
• Interface Type: I2C, USART
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 3
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• For Use With: 428-1681 - KIT USB FX1 DEVELOPMENT BOARD428-1677 - KIT DEVELOPMENT EZ-USB FX2LP428-1339 - KIT LOW SPEED PERSONALITY BOARD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 428-1680; CY7C64713-56LFXC

Document #: 38-08039 Rev. *F
Via hole for thermally connecting the
QFN to the circuit board ground plane.
Figure 41. Cross section of the Area Underneath the QFN Package
PCB Material
Figure 42. Plot of the Solder Mask (White Area)
Figure 43. X-ray Image of the Assembly
Cu Fill
Solder Mask
0.013” dia
0.017” dia
This figure only shows the top three layers of the
circuit board: Top Solder, PCB Dielectric, and
the Ground Plane.
Cu Fill
PCB Material
CY7C64713
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