MPC8313EVRAFFB Freescale Semiconductor, MPC8313EVRAFFB Datasheet - Page 26

IC MPU POWERQUICC II PRO 516PBGA

MPC8313EVRAFFB

Manufacturer Part Number
MPC8313EVRAFFB
Description
IC MPU POWERQUICC II PRO 516PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8313EVRAFFB

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
333MHz
Voltage
0.95 V ~ 1.05 V
Mounting Type
Surface Mount
Package / Case
516-PBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8313E-RDB
Maximum Clock Frequency
400 MHz
Operating Supply Voltage
- 0.3 V to + 1.26 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Data Ram Size
16 KB
I/o Voltage
2.5 V
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
Program Memory Type
EEPROM/Flash
For Use With
MPC8313E-RDB - BOARD PROCESSOR
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8313EVRAFFB
Manufacturer:
FREESCAL
Quantity:
150
Part Number:
MPC8313EVRAFFB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Ethernet: Three-Speed Ethernet, MII Management
Figure 12
Figure 13
8.2.2
Table 30
26
At recommended operating conditions with NV
At recommended operating conditions with LV
REF_CLK clock fall time V
Note:
1. The symbols used for timing specifications follow the pattern of t
Data to clock output skew (at transmitter)
Data to clock input skew (at receiver)
Clock cycle duration
Duty cycle for 1000Base-T
inputs and t
receive timing (RMR) with respect to the time data input signals (D) reach the valid state (V) relative to the t
reference (K) going to the high (H) state or setup time. Also, t
the time data input signals (D) went invalid (X) relative to the t
Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular
functional. For example, the subscript of t
convention is used with the appropriate letter: R (rise) or F (fall).
presents the RGMII and RTBI AC timing specifications.
provides the AC test load.
shows the RMII receive AC timing diagram.
RGMII and RTBI AC Timing
(first two letters of functional block)(reference)(state)(signal)(state)
REF_CLK
RXD[1:0]
CRS_DV
Parameter/Condition
Parameter/Condition
RX_ER
3
MPC8313E PowerQUICC
IH
Table 29. RMII Receive AC Timing Specifications (continued)
4, 5
Output
(max) to V
Table 30. RGMII and RTBI AC Timing Specifications
Figure 13. RMII Receive AC Timing Diagram
2
t
RMRDVKH
t
IL
RMXH
(min)
DDA
DD
RMX
of 3.3 V ± 0.3 V.
/LV
t
DDB
RMX
represents the RMII (RM) reference (X) clock. For rise and fall times, the latter
Figure 12. AC Test Load
Z
0
of 2.5 V ± 5%.
II Pro Processor Hardware Specifications, Rev. 3
= 50 Ω
Valid Data
Specifications
RMRDXKL
RMX
t
t
RGTH
Symbol
Symbol
RMXF
t
t
t
SKRGT
SKRGT
(first three letters of functional block)(signal)(state)(reference)(state)
RMXF
t
RGT
for outputs. For example, t
clock reference (K) going to the low (L) state or hold time.
/t
RGT
symbolizes RMII receive timing (RMR) with respect to
1
1
R
t
L
RMRDXKH
t
RMXR
= 50 Ω
–0.5
Min
Min
1.0
1.0
7.2
45
NV
DD
RMRDVKH
Typ
Typ
8.0
50
/2
Freescale Semiconductor
symbolizes RMII
Max
Max
4.0
0.5
2.8
8.8
55
RMX
clock
Unit
Unit
ns
ns
ns
ns
%
for

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