MPC8313EVRAFFB Freescale Semiconductor, MPC8313EVRAFFB Datasheet - Page 87

• Manufacturer Part Number: MPC8313EVRAFFB
• Description: IC MPU POWERQUICC II PRO 516PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8313EVRAFFB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 333MHz
• Voltage: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8313E-RDB
• Maximum Clock Frequency: 400 MHz
• Operating Supply Voltage: - 0.3 V to + 1.26 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Ram Size: 16 KB
• I/o Voltage: 2.5 V
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• Program Memory Type: EEPROM/Flash
• For Use With: MPC8313E-RDB - BOARD PROCESSOR
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

21.3
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force.
If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic
surfaces and its performance verified under the application requirements.
21.3.1
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction to case
thermal resistance.
where:
Freescale Semiconductor
The Bergquist Company
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
T
T
R
P
J
C
θ
D
Heat Sink Attachment
JC
= junction temperature (°C)
= case temperature of the package
= power dissipation
Experimental Determination of the Junction Temperature with a
Heat Sink
= junction-to-case thermal resistance
T
J
= T
MPC8313E PowerQUICC
C
+ (R
θ
JC
x P
D
)
™
II Pro Processor Hardware Specifications, Rev. 3
800-347-4572
Thermal
87