TDA8023TT/C1,118 NXP Semiconductors, TDA8023TT/C1,118 Datasheet - Page 16

• Manufacturer Part Number: TDA8023TT/C1,118
• Description: IC SMART CARD INTERFACE 28-TSSOP
• Manufacturer: NXP Semiconductors

Specifications of TDA8023TT/C1,118

• Package / Case: 28-TSSOP
• Controller Type: Smart Card Interface
• Interface: I²C
• Voltage - Supply: 2.7 V ~ 6.5 V
• Current - Supply: 200mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935274975118; TDA8023TT-T; TDA8023TT-T

NXP Semiconductors
9. Limiting values
Table 13.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
10. Thermal characteristics
Table 14.
TDA8023_1
Product data sheet
Symbol
V
V
V
V
P
T
T
V
Symbol
R
stg
j
DD
DD(DCDC)
DD(INTF)
IH
tot
esd
th(j-a)
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining. Method 3015 (HBM;
1500 ; 100 pF) defines 3 pulses positive and 3 pulses negative on each pin referenced to ground.
Limiting values
Thermal characteristics
Parameter
supply voltage
DC-to-DC converter
supply voltage
interface supply voltage
HIGH-level input voltage on pins SAP, SAM, SBP, SBM, VUP
total power dissipation
storage temperature
junction temperature
electrostatic discharge
voltage
Parameter
thermal resistance from junction to ambient
In case of overcurrent on pin V
supply dropout, DC-to-DC out of limits, or overcurrent on pin RST, the TDA8023 performs
an automatic emergency deactivation sequence on the card, resets bit START and pulls
pin INT LOW.
Conditions
on pin V
on pin V
on pin V
on pins SDA, SCL
on all other pins
T
Human Body Model (HBM)
Machine Model (MM)
amb
on card pins I/O, V
on all other pins
all pins, excluding card pins
= 25 C to +85 C
DD
DDP
DDI
Rev. 01 — 16 July 2007
CC
CC
, removal of the card during a session, overheating,
, CLK, GNDC, PRES, RST
Conditions
in free air
Low power IC card interface
[1]
Min
-
-
0.5
0.5
0.5
0.5
0.5
0.5
55
6
2
200
TDA8023
© NXP B.V. 2007. All rights reserved.
Typ
100
Max
+6.5
+6.5
+6.5
+7.5
+6.5
V
500
+150
150
+6
+2
+200
DD
+ 0.5 V
Unit
K/W
16 of 32
Unit
V
V
V
V
V
mW
kV
kV
V
C
C