TDA8023TT/C1,118 NXP Semiconductors, TDA8023TT/C1,118 Datasheet - Page 32
![IC SMART CARD INTERFACE 28-TSSOP](/photos/6/52/65262/568-28-tssop_sot361-1_sml.jpg)
TDA8023TT/C1,118
Manufacturer Part Number
TDA8023TT/C1,118
Description
IC SMART CARD INTERFACE 28-TSSOP
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8023TTC1118.pdf
(32 pages)
Specifications of TDA8023TT/C1,118
Package / Case
28-TSSOP
Controller Type
Smart Card Interface
Interface
I²C
Voltage - Supply
2.7 V ~ 6.5 V
Current - Supply
200mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935274975118
TDA8023TT-T
TDA8023TT-T
TDA8023TT-T
TDA8023TT-T
NXP Semiconductors
18. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.2.1
8.2.2
8.2.3
8.2.4
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.3.5
8.4
8.4.1
8.4.2
8.5
8.6
8.6.1
8.6.2
8.7
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
16.1
16.2
16.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16
Thermal characteristics. . . . . . . . . . . . . . . . . . 16
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 17
Application information. . . . . . . . . . . . . . . . . . 24
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 26
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 30
Legal information. . . . . . . . . . . . . . . . . . . . . . . 31
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Power supplies . . . . . . . . . . . . . . . . . . . . . . . . . 6
Voltage supervisor . . . . . . . . . . . . . . . . . . . . . . 6
Without external divider on pin PORADJ . . . . . 6
With external divider on pin PORADJ. . . . . . . . 7
External capacitor on pin CDEL . . . . . . . . . . . . 7
Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . 8
I
I
Bus conditions . . . . . . . . . . . . . . . . . . . . . . . . . 8
Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Device addressing . . . . . . . . . . . . . . . . . . . . . . 9
Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
DC-to-DC converter . . . . . . . . . . . . . . . . . . . . 12
Capacitive configuration . . . . . . . . . . . . . . . . . 12
Inductive configuration . . . . . . . . . . . . . . . . . . 13
V
Sequencer and clock counter . . . . . . . . . . . . . 13
Activation sequence . . . . . . . . . . . . . . . . . . . . 13
Deactivation sequence . . . . . . . . . . . . . . . . . . 15
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Introduction to soldering . . . . . . . . . . . . . . . . . 27
Wave and reflow soldering . . . . . . . . . . . . . . . 27
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 27
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 28
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2
2
CC
C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . . 8
buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
16.4
17
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Contact information . . . . . . . . . . . . . . . . . . . . 31
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Low power IC card interface
Document identifier: TDA8023_1
TDA8023
Date of release: 16 July 2007
All rights reserved.