DSPIC30F3011-30I/PT Microchip Technology Inc., DSPIC30F3011-30I/PT Datasheet - Page 233

• Manufacturer Part Number: DSPIC30F3011-30I/PT
• Description: 16 BIT MCU/DSP 44LD 30MIPS 24 KB FLASH
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC30F3011-30I/PT

• A/d Inputs: 9-Channels, 10-Bit
• Cpu Speed: 30 MIPS
• Eeprom Memory: 1K Bytes
• Input Output: 30
• Interface: I2C/SPI/UART, USART
• Ios: 30
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 44-pin TQFP
• Programmable Memory: 24K Bytes
• Ram Size: 1K Bytes
• Timers: 5-16-bit, 2-32-bit
• Voltage, Range: 2.5-5.5
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

80-Lead Plastic Thin Quad Flatpack 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
 2004 Microchip Technology Inc.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-092
c
B
*Controlling Parameter
Notes:
β
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
p
Dimension Limits
#leads=n1
E1
E
Units
CH
A2
(F)
D1
n1
E1
A1
φ
D
B
n
p
A
L
E
c
α
β
n
MIN
.004
Preliminary
.039
.037
.002
.018
.463
.463
.007
.025
.541
.541
2
1
5
5
0
D1
L
φ
CH x 45°
INCHES
D
NOM
.020
.043
.004
.024
.472
.472
.006
.035
.039
.039
.009
.551
.551
A1
3.5
80
20
10
10
A
MAX
.047
.006
.030
.482
.482
.008
.045
.011
.041
.561
.561
15
15
7
(F)
MIN
13.75
13.75
11.75
11.75
0.64
1.00
0.95
0.05
0.45
0.09
0.17
0
5
5
MILLIMETERS*
NOM
14.00
14.00
12.00
12.00
dsPIC30F
1.10
1.00
0.10
0.60
1.00
0.15
0.22
0.89
0.50
3.5
10
10
80
20
DS70082G-page 231
MAX
A2
14.25
14.25
12.25
12.25
0.20
0.27
1.14
1.20
1.05
0.15
0.75
α
15
15
7