FIN12ACGFX Fairchild Semiconductor, FIN12ACGFX Datasheet

IC SERIALIZER/DESERIALIZER 42BGA

FIN12ACGFX

Manufacturer Part Number
FIN12ACGFX
Description
IC SERIALIZER/DESERIALIZER 42BGA
Manufacturer
Fairchild Semiconductor
Series
SerDes™r
Datasheet

Specifications of FIN12ACGFX

Function
Serializer/Deserializer
Data Rate
560Mbps
Input Type
LVCMOS
Output Type
LVCMOS
Number Of Inputs
12
Number Of Outputs
12
Voltage - Supply
1.65 V ~ 3.6 V
Operating Temperature
-30°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
42-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FIN12ACGFXTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FIN12ACGFX
Manufacturer:
VISHAY
Quantity:
3 791
Part Number:
FIN12ACGFX
Manufacturer:
Fairchild Semiconductor
Quantity:
10 000
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Leng, HooiChin
E-mail: HooiChin.Leng@notes.fairchildsemi.com
Phone: 604-6437211, ext.788
Implementation of change:
Expected 1st Device Shipment Date: 2007/05/31
Earliest Year/Work Week of Changed Product: 0724
Change Type Description: Bond Wire Material Composition, Lead Finish Composition, Lid or
Base Material Composition, Mold Compound
Description of Change (From): Mold compound Sumitomo G770; Bond wire HP(99.99); Solder
ball composition SAC405; Solder mask material AUS05
Description of Change (To): Mold compound Nitto GE-100-LFC-S; Bond wire HTS(99.0);
Solder ball composition SAC105; Solder mask material AUS308
Reason for Change : To improve the robustness of the package bill of materials resulting in
increased resistance to intermettalic degradation, use of a Green mold compound, and improved
tolerance to mechanical shock. Overall, the BOM change is being pursued to improve the
reliability of the product.
Qual/REL Plan Numbers : Q20060387
Qualification :
All environmental & mechanical stresses outlined in reliability qualification plan
Q20060387 successfully meet the requirements for release, qualifying Nitto
GE-100-LFC-S green mold compound for use with all BGA42 products assembled at
Amkor Philippines.
Change From
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Technical Contact:
Name: Morneault, Ron
E-mail: Ron.Morneault@fairchildsemi.com
Phone: 207 761 3412
Date Issued On : 2007/05/09
Date Created : 2007/04/18
PCN# : Q1070902-A
Pg. 1

Related parts for FIN12ACGFX

FIN12ACGFX Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Change To Results/Discussion Test: (High Temperature Storage Life) Lot Device Q20060387AAHTSLD FIN224ACGFX Q20060387AAHTSLD FIN224ACGFX Q20060387ABHTSLD FIN224ACGFX Q20060387ABHTSLD FIN224ACGFX Q20060387ACHTSLD FIN224ACGFX Q20060387ACHTSLD FIN224ACGFX Test: (Static Op Life) Lot Device Q20060387AASOPL1D Q20060387ABSOPL1D Q20060387ACSOPL1D Test: -65C, 150C (Temperature Cycle) Lot Device Q20060387AATMCL1D FIN224ACGFX ...

Page 3

... Product Id Description : Affected FSIDs : FIN12ACGFX FIN24ACGFX FIN668CGFX FIN212ACGFX FIN24CGFX FIN670CGFX FIN224ACGFX FIN324CGFX Pg. 3 ...

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