MT48H16M32LFCM-75 IT ES Micron Technology Inc, MT48H16M32LFCM-75 IT ES Datasheet - Page 85
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MT48H16M32LFCM-75 IT ES
Manufacturer Part Number
MT48H16M32LFCM-75 IT ES
Description
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet
1.MT48H16M32LFCM-75_IT_ES.pdf
(86 pages)
Specifications of MT48H16M32LFCM-75 IT ES
Organization
16Mx32
Density
512Mb
Address Bus
15b
Access Time (max)
8/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
95mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
Revision History
Rev. H, Production – 12/09
Rev. G, Production – 8/09
Rev. F, Production – 4/09
Rev. E, Production – 3/09
Rev. D, Production – 2/09
Rev. C, Production – 12/08
Rev. B, Preliminary – 4/08
Rev. A, Advance – 10/07
PDF: 09005aef82ea3742
512mb_mobile_sdram_y47m.pdf – Rev. H 12/09 EN
• Changed
• Updated format.
• AC Functional Characteristics table: Updated note 9.
• Typical I
• VFBGA Ball Descriptions table: Deleted ballout columns.
• I
• AC Functional Characteristics table: Corrected typographical error in heading.
• Options section: Added low-power option.
• 512Mb Mobile LPSDR Part Numbering figure: Added low-power option.
• I
• I
• I
• I
• Electrical Characteristics and Recommended AC Operating Conditions table: Upda-
• Target Output Drive Characteristics (Full Strength), Target Output Drive Characteris-
• Initial release.
tables: Updated values.
low-power option.
auto refresh current to
refresh current to
ted values for
tics (Three-Quarter Strength), and Target Output Drive Characteristics (One-Half
Strength) tables: Added drive-strength tables.
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Specifications and Conditions (x16) and I
Specifications and Conditions (x16) table: Updated I
Specifications and Conditions (x32): Updated I
Specifications and Conditions (x16 and x32) table: Added column with values for
Curves figure: Added figure.
DD7
t
RFC from 97.5ns to 72ns in Table 10 (page 20).
Curves figure: Changed current units on y-axis from mA to µA.
t
CH,
t
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
RFC = 110ns.
t
CL.
t
RFC = 110ns.
85
Micron Technology, Inc. reserves the right to change products or specifications without notice.
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Specifications and Conditions (x32)
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values and changed I
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values and changed I
© 2007 Micron Technology, Inc. All rights reserved.
Revision History
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auto
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