PPC405GPR-3BB400 Applied Micro Circuits Corporation, PPC405GPR-3BB400 Datasheet - Page 38

• Manufacturer Part Number: PPC405GPR-3BB400
• Manufacturer: Applied Micro Circuits Corporation

Specifications of PPC405GPR-3BB400

• Family Name: 405GPr
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 400MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8/1.85V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7/1.8V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 456
• Package Type: EBGA
• Lead Free Status / Rohs Status: Not Compliant

405GPr – Power PC 405GPr Embedded Processor
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device
38
Package Thermal Specifications
The PPC405GPr is designed to operate within a case temperature range of -40°C to +85°C
E-PBGA packages (leaded and lead-free) in a convection environment are as follows:
Notes:
Supply Voltage (Internal Logic)
Supply Voltage (I/O Interface)
PLL Supply Voltage
Input Voltage (1.8V CMOS receivers)
Input Voltage (3.3V LVTTL receivers)
Input Voltage (5.0V LVTTL receivers)
Storage Temperature Range
Case temperature under bias
Notes:
1. All specified voltages are with respect to GND.
2. Empirical data indicates that all chip voltages should begin to ramp-up within 1 ms of each other. There should never be voltage present
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
3. 333MHz operated at 266MHz or less can operate at +105°C.
a. Case temperature, T
b. T
c. T
at the I/O pins before OV
Package—Thermal Resistance
A
CMax
35mm, 456-balls—Case-to-Ambient
27mm, 456-balls—Case-to-Ambient
= T
35mm, 456-balls—Junction-to-Case
27mm, 456-balls—Junction-to-Case
= T
C
– P
JMax
×θ
Characteristic
– P
CA
×θ
, where T
JC
C
, is measured at top center of case surface with device soldered to circuit board.
DD
, where T
is within operating range.
A
is ambient temperature and P is power consumption.
JMax
is maximum junction temperature and P is power consumption.
1
1
Symbol
Symbol
OV
AV
T
V
V
V
V
T
θ
θ
STG
θ
θ
DD
IN
IN
IN
C
DD
JC
CA
JC
CA
DD
0 (0)
14
18
2
2
-0.6 to OV
-0.6 to OV
-0.6 to V
ft/min (m/sec)
-55 to +150
-40 to +120
0 to +1.95
0 to +1.95
100 (0.51)
0 to +3.6
Airflow
Value
Revision 2.05 – March 24, 2008
13
16
3
DD
2
2
. Thermal resistance values for the
DD
DD
+ 0.45
+ 0.6
+ 2.4
Data Sheet
200 (1.02)
12
15
2
2
Unit
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
V
V
V
V
V
V
AMCC