PCF8584P NXP Semiconductors, PCF8584P Datasheet - Page 2

• Manufacturer Part Number: PCF8584P
• Manufacturer: NXP Semiconductors

Specifications of PCF8584P

• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: PDIP
• Rad Hardened: No
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.8.1
6.8.1.1
6.8.1.2
6.8.1.3
6.8.1.4
6.8.1.5
6.8.1.6
6.8.2
6.8.2.1
6.8.2.2
6.8.2.3
6.8.2.4
6.8.2.5
6.8.2.6
6.8.2.7
6.9
6.10
6.11
6.11.1
6.11.2
6.12
6.12.1
6.12.2
6.12.3
1997 Oct 21
I
2
C-bus controller
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
General
Interface Mode Control (IMC)
Set-up registers S0', S2 and S3
Own address register S0'
Clock register S2
Interrupt vector S3
Data shift register/read buffer S0
Control/status register S1
Register S1 control section
PIN (Pending Interrupt Not)
ESO (Enable Serial Output)
ES1 and ES2
ENI
STA and STO
ACK
Register S1 status section
PIN bit
STS
BER
LRB/AD0
AAS
LAB
BB
Multi-master operation
Reset
Comparison to the MAB8400 I
Deleted functions
added functions
Special function modes
Strobe
Long-distance mode
Monitor mode
2
C-bus interface
2
7
7.1
7.2
8
9
10
11
12
13
14
14.1
15
16
16.1
16.2
16.2.1
16.2.2
16.3
16.3.1
16.3.2
16.3.3
17
18
19 PURCHASE OF PHILIPS I
SOFTWARE FLOWCHART EXAMPLES
Initialization
Implementation
I
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
I
PARALLEL INTERFACE TIMING
APPLICATION INFORMATION
Application Notes
PACKAGE OUTLINES
SOLDERING
Introduction
DIP
Soldering by dipping or by wave
Repairing soldered joints
SO
Reflow soldering
Wave soldering
Repairing soldered joints
DEFINITIONS
LIFE SUPPORT APPLICATIONS
2
2
C-BUS TIMING DIAGRAMS
C-BUS TIMING SPECIFICATIONS
2
C COMPONENTS
Product specification
PCF8584