BUK129-50DL NXP Semiconductors, BUK129-50DL Datasheet - Page 2

• Manufacturer Part Number: BUK129-50DL
• Manufacturer: NXP Semiconductors
• Type: Power MOSFETr

Specifications of BUK129-50DL

• Number Of Elements: 1
• Polarity: N
• Channel Mode: Enhancement
• Drain-source On-res: 0.1Ohm
• Drain-source On-volt: 50V
• Continuous Drain Current: 16A
• Power Dissipation: 65W
• Operating Temp Range: -55C to 150C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 2 +Tab
• Package Type: D2PAK
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
ESD LIMITING VALUE
OVERVOLTAGE CLAMPING LIMITING VALUES
At a drain source voltage above 50 V the power MOSFET is actively turned on to clamp overvoltage transients.
OVERLOAD PROTECTION LIMITING VALUE
With an adequate protection supply provided via the input pin, TOPFET can protect itself from two types of overload
- overtemperature and short circuit load.
THERMAL CHARACTERISTICS
1 Prior to the onset of overvoltage clamping. For voltages above this value, safe operation is limited by the overvoltage clamping energy.
2 A higher T
3 All control logic and protection functions are disabled during conduction of the source drain diode.
May 2001
Logic level TOPFET
SMD version of BUK118-50DL
SYMBOL PARAMETER
V
I
I
I
I
P
T
T
T
SYMBOL PARAMETER
V
SYMBOL PARAMETER
E
E
SYMBOL PARAMETER
V
SYMBOL PARAMETER
R
R
D
D
I
IRM
stg
j
sold
DS
D
C
DSM
DRM
DS
th j-mb
th j-a
j
is allowed as an overload condition but at the threshold T
Continuous drain source voltage
Continuous drain current
Continuous drain current
Continuous input current
Non-repetitive peak input current
Total power dissipation
Storage temperature
Continuous junction temperature
Case temperature
Electrostatic discharge capacitor
voltage
Inductive load turn-off
Non-repetitive clamping energy
Repetitive clamping energy
Drain source voltage
Thermal resistance
Junction to mounting base
Junction to ambient
3
1
2
CONDITIONS
minimum footprint FR4 PCB
-
CONDITIONS
V
V
T
normal operation
during soldering
CONDITIONS
Human body model;
C = 250 pF; R = 1.5 kΩ
CONDITIONS
I
T
T
REQUIRED CONDITION
4 V ≤ V
DM
-
-
t
mb
-
mb
mb
IS
IS
p
j(TO)
≤ 1 ms
= 16 A; V
= 5 V; T
= 5 V; T
≤ 25 ˚C
≤ 25 ˚C
≤ 95 ˚C; f = 250 Hz
2
the over temperature trip operates to protect the switch.
IS
≤ 5.5 V
mb
mb
DD
= 25 ˚C
≤ 125 ˚C
≤ 20 V
MIN.
MIN.
MIN.
MIN.
MIN.
-10
-55
-
-
-5
0
-
-
-
-
-
-
-
-
-
TYP.
1.75
50
BUK129-50DL
Product specification
limited
MAX.
MAX.
MAX.
MAX.
self -
175
150
260
200
50
16
10
65
32
35
5
2
MAX.
1.92
-
Rev 1.900
UNIT
UNIT
UNIT
UNIT
mA
mA
mJ
mJ
kV
UNIT
˚C
˚C
˚C
W
K/W
K/W
V
A
A
V