BUK129-50DL NXP Semiconductors, BUK129-50DL Datasheet - Page 5

• Manufacturer Part Number: BUK129-50DL
• Manufacturer: NXP Semiconductors
• Type: Power MOSFETr

Specifications of BUK129-50DL

• Number Of Elements: 1
• Polarity: N
• Channel Mode: Enhancement
• Drain-source On-res: 0.1Ohm
• Drain-source On-volt: 50V
• Continuous Drain Current: 16A
• Power Dissipation: 65W
• Operating Temp Range: -55C to 150C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 2 +Tab
• Package Type: D2PAK
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
MECHANICAL DATA
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.4 g
May 2001
Logic level TOPFET
SMD version of BUK118-50DL
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
Plastic single-ended surface mounted package (Philips version of D
(one lead cropped)
DIMENSIONS (mm are the original dimensions)
UNIT
mm
Fig.2. SOT404 surface mounting package
OUTLINE
VERSION
SOT404
4.50
4.10
A
H D
1.40
1.27
A 1
D
D 1
0.85
0.60
b
IEC
0.64
0.46
c
max.
1
11
D
e
E
JEDEC
1.60
1.20
D 1
2
e
REFERENCES
10.30
9.70
E
3
0
b
2.54
e
scale
EIAJ
2.5
5
1
, centre pin connected to mounting base.
2.90
2.10
L p
5 mm
15.40
14.80
H D
mounting
2.60
2.20
2
Q
base
-PAK); 3 leads
L p
A 1
Q
PROJECTION
c
EUROPEAN
A
ISSUE DATE
98-12-14
99-06-25
BUK129-50DL
Product specification
SOT404
Rev 1.900